High power density and temperature stable vertical-cavity surface-emitting laser with a ring close packing structure

Wei Li,Yu-Xuan Qi,Su-Ping Liu,Xiao-Yu Ma
DOI: https://doi.org/10.1016/j.optlastec.2020.106510
2020-12-01
Abstract:<p>We report on the design and fabrication of high power density vertical-cavity surface-emitting laser (VCSEL) with ring close packing structure (RCP) emitting at 808 nm. The RCP-VCSELs with a broad area of 100 μm in diameter contains seven-small-mesas sharing the same super-cavity, and the oxide-aperture diameters of each small mesa was 20 μm. A detailed theoretical analysis is conducted with the help of a thermoelectric model and far-field model. The current density distribution and temperature characteristics were improved. The RCP-VCSELs with maximum power density of 3.73 kW/cm<sup>2</sup>, slope efficiency of 1.1 W/A, and overall wall-plug efficiency (WPE) of 35% have been realized from the broad area of 100 μm in diameter. An improved transverse-mode emission performance featuring a low beam divergence of FWHM (3.3°) and a stable temperature tolerance of the studied device shows the potential of our approach. It is anticipated that this work will provide an effective strategy for the fabrication of high performance large-area VCSELs with good beam quality under ambient and harsh conditions.</p>
optics,physics, applied
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