Mechanical characteristics of NiTiCu alloys from experiments and molecular dynamics simulations

Shih-Wei Liang, Te-Hua Fang, Tang-Yu Lai, Kai-Peng Lin, Yu-Cheng Fan
2019-12-01
Abstract:In this article, we report investigations of the mechanical characteristics of Nisingle bondTisingle bondCu alloys using experimental compression, nanoindentation, and molecular dynamics (MD) simulations. The results show that an amorphous pillar is harder to compress than a nanocrystalline one, with the hardness of the Nisingle bondTisingle bondCu alloys we used ranging from 2.51 to 4.98 GPa. In the MD simulations, the substrate has a greater effect at the bottoms of the shorter pillars. Adhesion occurred at the upper surfaces of nanopillars that were 200 nm long. We also discuss the effects of size on the deformation response of the Nisingle bondTisingle bondCu nanopillars.
What problem does this paper attempt to address?