Effect of temperature and reduction ratio on the interface bonding properties of TC4/304 plates manufactured by EA rolling

Xiongwei Guo,Zhongkai Ren,Xiaobao Ma,Ning Li,Liping Bian,Tao Wang

DOI: https://doi.org/10.1016/j.jmapro.2021.02.006

IF: 5.684

2021-04-01

Journal of Manufacturing Processes

Abstract:<p>In this paper, a TC4/ 304 plate was successfully manufactured by electrically-assisted rolling (EA rolling). Under the constant pulse current, the effect of EA rolling on the interfacial structure and interfacial bonding strength of TC4/304 plates was systematically studied at different rolling reduction ratios of 19.5%, 38% and 58% at 750 °C and at reduction ratios of 58% when the rolling temperatures were 650 °C, 750 °C and 850 °C. The microinterface and shear fracture surface were analysed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) was employed to determine the formation of the phase. The interfacial bonding properties of the plates were tested by tensile shear. The results show that under action of pulse current, the tensile shear strength of the TC4/304 plate is the highest at 750℃×38%, reaching 286 MPa. Insufficient element diffusion caused by small reduction ratio and Kirkendall micro voids caused by diffusion acceleration with large reduction lead to the decrease of tensile shear strength. When the reduction ratio is 58%, the tensile shear strength reaches 239 MPa at 650 ℃. Kirkendall micro voids at 750 ℃ and the intermetallic compounds at 850 ℃ lead to the continuous decrease of shear strength. EA rolling is the primary factor that lead to the substantial increase in the interface bonding strength of the TC4/304 plate at low temperature and small deformation.</p>

engineering, manufacturing