Abstract:The electrical packaging for high power devices such as IGBT or MOSFET is achieved by heavy aluminum ultrasonic wire bonding. In this process, the amplitude stability of ultrasonic transducer determines the bonding quality, which demands more accuracy in resonant frequency tracking (RFT) and constant amplitude control (CAC). In this investigation, we proposed a vector based resonant frequency (VRFT) tracking and vector based constant amplitude control (VCAC) to control the ultrasonic transducer. The current of dynamic branch was conducted by calculating the voltage and current vector of ultrasonic transducer. Small signal model of ultrasonic transducer was established and applied into RFT and CAC. A control strategy of fuzzy self-tuning PID closed loop was utilized to RFT and CAC. The PID parameters was calculated by the linear control theories and modified by the fuzzy controller which improved the vibration stability of the transducer. A prototype of 100Watt/60kHz ultrasonic driver was self-developed to verify the VRFT and VCAC. It demonstrated that the locked frequency of VRFT can be controlled within less than 0.04 millisecond when staring from the swept frequency, and the vibration response is fast with the varying bonding pressure. The amplitude of fuzzy PID VCAC is more stable and robust compared to the classical PID control, which improved the bonded joint quality in heavy aluminum wire packaging. Note to Practitioners—This article was motivated by the reliability and efficiency of IGBT/ MOSFET device packaging through ultrasonic aluminum wire bonding. This bonding process requires more amplitude stability of the ultrasonic transducer to achieve acceptable bonded quality. Currently, the resonant frequency tracking (RFT) by classical PID control is in slow speed, and the amplitude of the transducer cannot be controlled constantly due to the inherent static capacitor of the transducer. These issues for the ultrasonic control are originated from the engineer’s experience or simple heuristic rule instead of advanced approaches. To improve the vibration performance, we proposed a vector based model consisting of the relationship the dynamic branch current and the total current of the transducer, to control the RFT and constant amplitude control (CAC). Moreover, the vector based is utilized into the fuzzy PID control, where the calculation is reduced by area coefficient defuzzy. The verification experiments prove that the response time of the proposed vector based RFT and CAC, and the bonded joint quality is optimized obviously. It is noted that in our control strategy, the RMS value, the phase of voltage and current of the transducer are acquired by DSP processor, and the calculation of fuzzy PID controller is not complicated, which is feasible to implement in application. This significantly benefits the demand of accurate control to the ultrasonic power in electronic packaging.

A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding

A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process

Multi-actuated Mechanism Design Considering Structure Flexibility Using Correlated Performance Reinforcing

Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System

ACTIVE VIBRATION CONTROL FOR ARM STRUCTURE UNDERGOING HIGH ACCELERATION MOTION AND PRECISION POSITIONING

A novel quasi-intermittent vibration assisted swing cutting device: Design and experimental investigation

Design and Simulation of a Macro-Micro Dual-Drive High Acceleration Precision XY-stage for IC Bonding Technology

Dynamics Modeling and Residual Vibration Control of a Piezoelectric Gripper During Wire Bonding

Gripper vibration analysis of inspection robot during variable working flight of pre-landing on high-voltage transmission line

Simulation Of Displacement Response Of Capillary And Feature Extraction For Wire Bonding Process Monitoring

Adaptive Neural Preassigned-Time Control for Macro-Micro Composite Positioning Stage with Displacement Constraints

Multiple Modal Vibration and FEM Analysis of Ultrasonic Transducer for Thermsonic Flip Chip Bonding

Toward Ultrasonic Wire Bonding for High Power Device: A Vector Based Resonant Frequency Tracking and Constant Amplitude Control

Design and Positioning Control of a Flexure-Based Nano-positioning Stage Driven by Halbach Array Voice Coil Actuator

Simultaneous Optimization of Actuators' Configuration and Vibration Control in Ultra-Precision Motion Systems with a Time-Varying Performance Location

Optimization of Bonding Methods for Controlling Sn Spillage in Fine Pitch Microbump Applications

Multimode Vibration Analysis of Transducer in Thermosonic Flip Chip Bonding

A Novel Nanopositioning Stage Integrated with Voice Coil Motor and Active Eddy Current Damper

Analytical and Experimental Validation of Vibration Isolation System with Complementary Stiffness and Composite Control

A Timing-Aware 3D IC Bonding Optimization Method

Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding