Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Nonlinear electromechanical topology optimization method for stretchable electronic interconnect structures

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

Lateral Buckling and Mechanical Stretchability of Fractal Interconnects Partially Bonded Onto an Elastomeric Substrate

Mechanics of Noncoplanar Mesh Design for Stretchable Electronic Circuits

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Lateral Buckling of Interconnects in A Noncoplanar Mesh Design for Stretchable Electronics

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Mechanics of stretchable inorganic electronic materials

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Mechanics of Stretchable Electronics

Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics.

Mechanics design and analyses of stretchable electronics

A Strain-Isolation Design for Stretchable Electronics

Helically Intersected Conductive Network Design for Wearable Electronic Devices: From Theory to Application

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.