Laser-Induced Interfacial Spallation for Controllable and Versatile Delamination of Flexible Electronics
Jing Bian,Furong Chen,Biao Yang,Jinlong Hu,Ningning Sun,Dong Ye,Yongqing Duan,Zhouping Yin,YongAn Huang
DOI: https://doi.org/10.1021/acsami.0c18951
2020-11-19
Abstract:The control of interface status is greatly critical to release large-area, ultrathin flexible electronics from the donor wafer to achieve mechanical flexibility. This paper discovers a laser-induced interfacial spallation process for controllable and versatile delamination of polyimide (PI) films from transparent substrates and makes a comprehensive mechanism study of the controllability of interfacial delamination after laser irradiations. Microscopic observations show that backside irradiations will result in the formation of nanocavities around the PI–glass interface, enabling a significant decrease in interface adhesion. Theoretical calculations indicate that gas products generated from thermal decomposition of PI will cause hydrodynamic spallation of molten PI around the interface. The controllable spallation behavior benefits the formation/elimination of fibrous microconnections between the PI film and glass substrate. A substantial regulation of interfacial micromorphologies can achieve precise control of interface adhesion, mass production of functional nanostructures, and nondestructive peeling of ultrathin flexible devices. The results could be useful for the fabrication of flexible electronics and biomimetic surfaces.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c18951?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c18951</a>.Schematic illustrations of experimental platform involved in this study, blister formed by laser irradiations, microscopic observations of PI–glass interface, appearance of a bright stripe due to the equal thickness interference, temperature distributions of the interfacial PI, calculated maximum temperature in the constantan layer of the strain sensor, observations of the irradiated PI film with increasing irradiation times, fabrication process of a wavelike PI film and the nanopillar structures, surface morphologies of the PI films with different sets of laser parameters, cicada-wing-like nanopillared surface prepared in this research, mechanism of optical trapping and hydrophobicity of nanostructured surfaces; detail descriptions of the parameters used for modeling of the ablation process; and calculation process of the amount of gas products generated by laser irradiations (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c18951/suppl_file/am0c18951_si_001.pdf">PDF</a>)Mechanical peeling process after an incomplete separation process (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c18951/suppl_file/am0c18951_si_002.mp4">MP4</a>)Massive carbon particles flowing in the gap between the PI film and glass substrate (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c18951/suppl_file/am0c18951_si_003.mp4">MP4</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology