Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field

Xuan Liu,Ziheng Bai,Qianqian Liu,Yali Feng,Chaofang Dong,Lin Lu,Hong Luo,Jirui Wang,Shiwen Zou,Kui Xiao

DOI: https://doi.org/10.1039/d1ra03776e

IF: 4.036

2021-01-01

RSC Advances

Abstract:Proposed failure mechanism of electrochemical migration under an external magnetic field caused by mold.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation

Xiaofei He,Michael H. Azarian,Michael G. Pecht

DOI: https://doi.org/10.1016/j.electacta.2014.06.041

IF: 6.6

2014-01-01

Electrochimica Acta

Abstract:Electrochemical migration can occur on printed circuit boards when exposed to moisture or condensed water drops, thus causing dendrite electrodeposits, which can give rise to short circuits. This study used the Nernst Planck equation and impedance measurements to model the kinetics of electrochemical migration under condensed water drops between copper conductors on printed circuit boards. The time needed for an embryonic dendrite to appear at the cathode and for it to grow from cathode to anode was calculated by the model and confirmed experimentally. It was found that by determining the electroactive ion surface concentration at the anode with the help of impedance measurement, and by considering migration and diffusion in the bulk ion transport, the model matched the experimental results quantitatively. The model was also extended to non-condensing conditions by comparing the conductances in bulk water and moisture films. Historical models were applied to the experimental results and compared with the model of this study.
A new prediction methodology for electromigration-induced solder degradation in a WL-CSP system

Yong Liü,Qiang Wang,Lihua Liang,Xuefan Chen,Scott Irving,Timwah Luk

DOI: https://doi.org/10.1109/ECTC.2009.5074027

2009-01-01

Abstract:This paper proposes a new prediction method for electromigration induced void generation of solder bumps in a wafer level chip scale package (WL-CSP). The methodology is developed based on discretized residual weight method (RWM) in a user-defined finite element analysis (FEA) framework to solve the local electromigration governing equation with the variable of atomic concentration. The local solution of atomic concentration is incorporated in the multi-physics environment for electrical, thermal and stress in both sub-model and global model. The new method takes the advantage of solving the variable of atomic concentration, it avoids directly solving the divergences of the atomic flux, which includes the atomic concentration gradient items and is very hard and challenging to get the solution by traditional method. The simulation results for voids and time to failure (TTF) are discussed and correlated with previous test results. Comparison of the results with and without considering the atomic density gradient for representive nodes is investigated.
Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

Li Qicong,Zhu Linli,Ruan Haihui

DOI: https://doi.org/10.1007/s10338-021-00250-y

2021-01-01

Abstract:Semiconductor-based electronic devices usually work under multiphysics fields rendering complex electromagnetic–thermo–mechanical coupling. In this work, we develop a penalty function method based on a finite element analysis to tackle this coupling behavior in a metal/semiconductor bilayer plate—the representative unit of semiconductor antenna, which receives strong and pulsed electromagnetic signals. Under these pulses, eddy current is generated, of which the magnitude varies remarkably from one plate to another due to the difference in electrical conductivity. In the concerned system, the metal layer generates much larger current, resulting in the large temperature rise and the nonnegligible Lorentz force, which could lead to delamination and failure of the semiconductor-based electronic device. This study provides theoretical guidance for the design and protection of semiconductor-based electronic devices in complex environments.
An Electro-Thermo-mechanical Coupling Phase-Field Model of Defect Evolution Induced by Electromigration in Interconnects

Xin-Wei Wu,Mingyang Chen,Liao-Liang Ke

DOI: https://doi.org/10.1016/j.ijmecsci.2024.109792

IF: 7.3

2025-01-01

International Journal of Mechanical Sciences

Abstract:In this paper, the defect evolution caused by electromigration induced surface diffusion in interconnects is investigated using a newly-developed electro-thermo-mechanical coupling phase-field model. The Joule heat and its resulting thermomigration are included into the phase-field model. The governing equation of the phase-field is solved by semi-implicit spectral methods and the accompanied governing equations of applied physics fields are solved by finite volume methods. Comparative investigation into defect evolution with and without the influence of Joule heating is conducted. It is deduced that thermomigration facilitates local elongation of the defect in the "current crowding" region and exerts a substantial influence on the defect morphological evolution. Subsequently, the effect of the inclination angle of the electric field on the void morphology evolution and crack propagation is discussed. We find that the defect achieves the largest characteristic length when the electric field direction is perpendicular to the uniaxial tension direction, implying a higher threat to the circuit safety. This study may help to deepen people's understanding of how the thermal effect functions in electromigration process and sheds light on different modes of defect evolution in interconnects.
Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

Zhang G.,Tan C. M.,Gan Z. H.,Prasad K.,Zhang D. H.

DOI: https://doi.org/10.1557/proc-766-e3.16

2003-01-01

Abstract:Electromigration (EM) is a major reliability issue in VLSI. Many physical processes are involved simultaneously in an EM process, namely atom migration due to electron wind force, thermal migration due to temperature gradient, stress migration due to stress gradient, and surface migration (just when free surface is available) due to surface tension. In this work, the intrinsic EM damages of Al and Cu, that is without the effect from the surrounding materials, was investigated and compared based on the finite element analysis (FEA). The FEA results show that, in the intrinsic Al EM damage, electron wind force induced flux divergence is always the main cause of void growth; however, in the intrinsic Cu EM damage, dominant flux divergence varies with time, with the final dominant flux divergence due to electron wind force. It is also found that current density and temperature gradient are the most important factors affecting flux divergence. These simulation predictions agree with experimental observation and theoretical analysis.
Interaction between PCB-Cu corrosion and electrochemical migration under the Coupling of electric field and thin liquid film

Rongdie Zhu,Binxia Ma,Hongbin Zhang,Shaofeng Zhang,Jinyang Zhu

DOI: https://doi.org/10.1016/j.surfin.2024.104767

IF: 6.2

2024-07-15

Surfaces and Interfaces

Abstract:An in-situ monitoring and observation experimental setup was designed in the coupled environment of a thin liquid film and an electric field. The interactive development of PCB-Cu corrosion and electromigration under different bias voltages, salt concentrations, and liquid-film thicknesses was investigated, and an interactive model was proposed. The results showed that electromigration of copper was dominant at a high voltage of 3 V, whereas corrosion occurred without salt deposition at a low voltage of 1 V. The growth rate of the dendrites decreased with increasing liquid film thickness. In the presence of 1 g/m 2 of NaCl, dendrite growth was absent because corrosion precipitation occurred before dendrite formation, thereby hindering the migration of copper ions. At a higher NaCl deposition density of 10 g/m 2 , the electromigration of copper became dominant, resulting in the formation of many short dendrites, evenly distributed on the cathode at a low voltage of 1 V. These observations are consistent with the results of the in-situ current monitoring tests.

materials science, coatings & films,physics, applied,chemistry, physical, condensed matter
A Phase-field Model of Electrochemical Migration for Silver-based Conductive Adhesives

Chenrui Cao,Mingkun Yang,Chen Liang,Donglin Zhang,Xin Chen,Xiuchen Zhao,Chin C. Lee,Yongjun Huo

DOI: https://doi.org/10.1016/j.electacta.2023.143388

IF: 6.6

2023-10-22

Electrochimica Acta

Abstract:Electrochemical migration failure is the main reliability problem that silver conductive adhesives face in the field of power electronics. However, there is no prior existing study that describes the electrochemical migration process of silver conductive adhesive using the phase-field model. In this study, a phase-field model is proposed to study the electrochemical migration process of silver-based conductive adhesive. The model involves the analysis of electrochemical reactions, diffusion of metal ions, applied electrode potential and overpotential and the morphology of electrochemically migrating dendrites. Model-building is based on the water drop (WD) test of silver conductive adhesive. The simulation results of the phase-field model not only reproduce the morphology of the silver dendrite, but also realize the critical voltage phenomenon in the WD experiments. In addition, by comparing the results of WD experiments as well as the model simulations, we demonstrate that the phase-field model is able to predict the electrochemical migration failure time of silver conductive adhesives effectively. The proposed model may be a helpful tool for understanding and predicting the evolution of dendrites during the electrochemical migration of silver-based conductive adhesives.

electrochemistry
Grain boundaries-dominated migration failure of copper interconnect under multiphysics field: Insight from theoretical modeling and finite element analysis

Yixue Zhu,Hongwei Bao,Zhaokai Yang,Hongquan Jiang,Fei Ma

DOI: https://doi.org/10.1016/j.microrel.2024.115346

IF: 1.6

2024-02-26

Microelectronics Reliability

Abstract:As the feature size of Cu interconnects in microelectronic devices are miniaturized into micro- and even nano-scale, the effects of grain boundaries (GBs) on the electromigration (EM) failure become more and more obvious. It is of fundamentally importance to investigate the grain boundaries dominated failure mechanism and lifetime of Cu interconnects. In this work, the interconnection models containing different grain boundaries were constructed by using finite element simulations. The simulation results indicate that the current density at Cu grain boundaries is lower, but the current will be increased locally, when it is almost perpendicular to grain boundaries. However, the temperature is higher locally at grain boundaries. In the early stage of atomic diffusion, thermal migration and stress migration also occur near grain boundaries, resulting in significant atomic segregation near grain boundaries, particularly at the intersection of grain boundaries and near the inclined grain boundaries with small angles to the current direction. The atomic diffusion is considerably accelerated as the density of grain boundaries is increased, but is slowed down by poorly connected columnar grain boundaries.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Shuai Zhang,Xuesong Quan,Changhao Lin,Liqiang Cao,Xiangyu Chen,Jinhong Liu,Qingyang Qiu,Sunwu Xu,Peng He,Shuye Zhang

DOI: https://doi.org/10.1016/j.matlet.2024.137394

IF: 3

2024-09-16

Materials Letters

Abstract:The failure mechanism of electromigration (EM) for electronic packaging technology has garnered interest. Electromigration-caused voids reduce electronic device dependability. Two-step reflow at 250°C and 210°C was employed to create SAC305/SnPb micro-hybrid solder connections. Finite element analysis confirmed electromigration failure. After 768 h at 10A, the anode interface IMC thickness increased by 149.8 %, while the cathode IMC increased less. Polarity accelerates anode IMC growth. Electromigration of Cu from cathode to anode causes structural flaws and 44.6 % shear strength loss to 35.1 MPa. Fractures shift from inside the solder joint to the IMC layer, becoming brittle. COMSOL simulation demonstrates greatest current density, temperature, and stress at the current inlet and Cu pad-solder joint junction.

materials science, multidisciplinary,physics, applied
Numerical simulation study on the mold strength of magnetic mold casting based on a coupled electromagnetic-structural method

Wei-li Peng,Jian-hua Zhao,Cheng Gu,Ya-jun Wang

DOI: https://doi.org/10.1007/s41230-024-4116-4

2024-10-06

China Foundry

Abstract:The properties of the magnetic mold in magnetic mold casting directly determine the quality of the final cast parts. In this study, the magnetic mold properties in magnetic mold casting, were studied utilizing a coupled electromagnetic-structural method through numerical simulation. This study investigated key factors including equivalent stress, the distribution of tensile and compressive stresses, and the area ratio of tensile stress. It compared molds made entirely of magnetic materials with those made partially of magnetic materials. Simulation results indicate that as current increases from 4 A to 8 A, both the initial magnetic mold and the material-replaced magnetic mold initially show an increasing trend in equivalent stress, tensile-compressive stress, and the area ratio of tensile stress, peaking at 6 A before declining. After material replacement, the area ratio of tensile stress at 6 A decreases to 19.84%, representing a reduction of 29.72%. Magnetic molds comprising a combination of magnetic and non-magnetic materials exhibit sufficient strength and a reduced area ratio of tensile stress compared to those made entirely from magnetic materials. This study provides valuable insights for optimizing magnetic mold casting processes and offers practical guidance for advancing the application of magnetic molds.

metallurgy & metallurgical engineering
Thermomigration-induced failure in ball grid array solder joint under high current stressing

Peng Liu,Sen Cong,Shaobin Wang,Ping Wu

DOI: https://doi.org/10.1007/s10853-023-08678-y

IF: 4.5

2023-06-20

Journal of Materials Science

Abstract:In this work, rapid failure of a few minutes was observed in real ball grid array solder joints under high current density (8 × 10 3 and 1 × 10 4 A cm −2 ) at room temperature. For each test condition, the failure solder joint was detected at the same position of the daisy chain by computed tomography technology. Furthermore, the open failure for all solder joints was caused by the chip side (anode side) Cu dissolution. Microstructure evolution for a pair of electrically connected solder joints was investigated. In both solder joints, Cu atoms on the chip side were dissolved to the board side with the formation of intermetallic compound particles in solder matrix. Finite element simulation was introduced to calculate the current density, temperature, and heat flux distribution. The temperature gradient along the direction of Cu migration in solder joint was developed due to the accumulation of Joule heating. Thermomigration was confirmed as the dominant mechanism of chip side Cu dissolution.

materials science, multidisciplinary
Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices

Shiyao Du,Feng Li,Flemming Bjerg Grumsen,Rajan Ambat,Ao Tang,Ying Li

DOI: https://doi.org/10.1038/s41529-024-00440-2

2024-03-05

npj Materials Degradation

Abstract:Dendrite formation induced by electrochemical migration (ECM) is a common reliability problem occurring on printed circuit boards (PCBs), which significantly threatens the long-term safe operations of current implantable electronic devices (IEDs). Although several factors (i.e., contaminations, humidity, temperature) are proved to be the parameters closely related to ECM susceptibility of capacitors on a PCB under climate environments, further targeted research under other environments still needs to be conducted as ECM is highly environmental-dependent. Herein, the effects of bias potential and pitch dimension on ECM sensitivity are systematically studied using various sizes of capacitors on a test PCB under a human implantation environment. The finite element method first proves that a DC voltage pattern could be regarded as an accelerated test compared to other waveforms. Subsequent chronoamperometry tests using the DC potential further indicate that dendrite formation is closely related to pitch dimension under low bias potential, while under high bias potential electric field is also the dominating factor of dendrite formation for capacitors on a PCB. Benefiting from the electrochemical impedance spectroscopy (EIS) technique, the capacitor reliability under different corrosion states is also evaluated in a detailed manner. This work offers great value both in electronic corrosion mechanisms and future rational design for reliable IEDs.

materials science, multidisciplinary
Ion migration in p-type perovskite MAPbI3 films under an electric field and thin-film transistor device failure

Jiale Su,Zhenxin Yang,Xuanhe Li,Fushun Li,Juntao Hu,Nan Chen,Tao Zhang,Dengke Wang,Zheng-Hong Lu,Qiang Zhu

DOI: https://doi.org/10.1039/d4cc03446e

2024-09-26

Abstract:This study demonstrated a dynamic analysis to investigate the ion migration in p-type perovskite MAPbI3 films under an electric field, revealing its detrimental effects on the electrical performance of MAPbI3-based devices. An additive strategy was proposed to suppress ion migration, thereby facilitating the fabrication of high-performance MAPbI3-based devices.
Experimental research on chloride migration featureduring electrochemical chloride extraction under different electric field direction

Wenwen Zhang,Jianghong Mao,Yang Sun,Yaofeng Zhu,Jiansheng Shen,Weiliang Jin

DOI: https://doi.org/10.13614/j.cnki.11-1962/tu.2018.01.007

2018-01-01

Building Science

Abstract:In order to explore the characteristics of chloride ion migration during electrochemical chloride extraction (ECE) of concrete under different electric field directions,the shielded electrode array is embedded in the specimen,different electric field directions are constructed by arranging different anode surfaces.The electric field and the distribution characteristics of chloride ion in concrete with different electroosmosis surfaces are studied emphatically and their relationships are proved.The results show that the electric field distribution is different between the different electroosmosis surfaces concrete,and the electroosmosis surfaces and non-electroosmosis surfaces of the potential gradient are contrast significantly.But the direction of the internal electric field is pointing to the steel-bar.The distribution of chloride ions in the same specimen is different in different areas and the depth of different protective layers.There is a clear correlation between the concentration of chloride ion and the strength of electric field.
The Study of the Reliability of Complex Components during the Electromigration Process

Hao Cui,Wenchao Tian,Yiming Zhang,Zhiqiang Chen

DOI: https://doi.org/10.3390/mi14030499

IF: 3.4

2023-02-22

Micromachines

Abstract:With the increasing number of inputs and outputs, and the decreasing interconnection spacing, electrical interconnection failures caused by electromigration (EM) have attracted more and more attention. The electromigration reliability and failure mechanism of complex components were studied in this paper. The failure mechanism and reliability of complex components during the electromigration process were studied through the simulation and the experiment, which can overcome the limitation of experimental measurement at a micro-scale. The simulation results indicated that the solder joint has obvious current crowding at the current inlet, which will significantly enhance the electromigration effect. Based on the atomic flux divergence method, the void formation of solder joints can be effectively predicted, and life prediction can be more accurate than Black's equation. Experimental results indicated that the resistance of the daisy chain could be significantly increased with the process of void formation in the solder and corrosion of the leads. Moreover, the growth of intermetallic compounds can be obviously promoted under current stress. The main composition of the intermetallic compounds changes from almost entirely Cu5Sn6 to Cu5Sn6 and Cu3Sn; the cracks can be detected at the Cu3Sn layer. Specifically, the mean time to failure is 1065 h under 1.4 A current and 125 °C based on IPC-9701A guidelines.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Characteristics of Soil Pore Structure Response to Electric Field Strength and Their Effects on Cr(VI) Removal from a Historically Chromium-Contaminated Soil

Mao Gao,Fan Tang,Yongchao Zhao,Yixuan Chu,Yan Yang,Guangming Tian,Yanlong Wang,Huaqing Liu

DOI: https://doi.org/10.1016/j.cej.2024.156061

IF: 15.1

2024-01-01

Chemical Engineering Journal

Abstract:The characteristics of soil pore structure response to electric field strength and their effects on the migration of hexavalent chromium during electrokinetic remediation remain unclear. This paper investigates the effects of soil actual voltage and pore redistribution on hexavalent chromium removal under various voltage gradients during electrokinetic remediation. The electric field across the soil was the dominant factor that affected the soil properties, pore structure, and transportation of hexavalent chromium. The removal efficiency of dissolved hexavalent chromium was significantly enhanced from 36.1 % to 80.5 % as the theoretical voltage gradients increased from 0.5 Vcm(-1) to 3 Vcm(-1) due to the highest voltage proportion (52.7 %) of the soil chamber at 3 Vcm(-1), while it only increased to 82.0 % at 4 Vcm(-1). The optimal actual electric field strength of 1.00-1.50 Vcm(-1) across the soil matrix facilitated the efficient electromigration of hexavalent chromium. The electric field force exerted a direct (0.70) or indirect action intensity (1.55) on soil pore structure by altering soil chemical properties. Soil mesopores and ultra-micropores transformed into micropores through collapsing, shrinking, ion migration, weakening electrostatic repulsion, and enhancing adhesive bonding among particles with increasing electric field. The distribution and structure of soil pores were more homogenous under optimal electric field conditions, thereby improving the migration path of hexavalent chromium. Soil mesopores facilitated hexavalent chromium removal and the formed micropores were opposite. These findings have significant scientific and practical implications for applying the in-situ electrokinetic techniques in the remediation of metal-contaminated soils.
Experiment on repair effect of bidirectional electromigration rehabilitation on reinforced concrete：changing rule of protective layer strength

Chen XU,Wei-liang JIN,Nan HUANG,Hang-tong WU,Jiang-hong MAO,Jin XIA

DOI: https://doi.org/10.3785/j.issn.1008-973X.2015.06.018

2015-01-01

Abstract:Electromigration based bidirectional electromigration rehabilitation (BIEM ) technology was used to study the changing rule of protective layer strength in reinforced concrete blocks for repair . The protective layer strength was measured under different electric parameters ,water cement ratios ,initial chloride salt contents and surface carbonation situations .The measured results were compared with those of blocks after electrochemical chloride extraction (ECE ) to study the repair effect of BIEM on the protective layer strength .Mercury injection test was taken to study the pore structure distribution after electrochemical treatment .The results show that the protective layer strength decreases after BIEM ,and the decrease amplitude increases with the increase of current density and treatment duration .Moreover , water cement ratio , initial chloride salt content and surface carbonation also affect the decrease of strength .Protective layer porosity decreases a lot ,including both positive and negative pores .
Numerical simulation of electromigration failure in IC interconnect structures

Yuanxiang Zhang,Yong Liu,Lihua Liang

2010-01-01

Abstract:This paper investigates the electromigration induced void and hillock generation in IC interconnect structures and presents a new algorithm for electromigration failure analysis based on ANSYS and FORTRAN codes. The driving force for electromigration induced failure considered here includes the electron wind force, stress gradient, temperature gradient, as well as the atomic density gradient, which were neglected in many of the existing researches on eletromigration. The comparison of void/hillock formation and the time to failure (TTF) life through numerical example of the SWEAT structure with the measurement results are investigated and discussed.
Significant mechanical softening of copper under coupled electric and magnetic stimuli

Yueqing Yang,Yuecun Wang,Huanhuan Lu,Zhangjie Wang,Degang Xie,Yongfeng Zhao,Junli Du,Chaohua Wang,En Ma,Zhiwei Shan

DOI: https://doi.org/10.1016/j.scriptamat.2023.115438

IF: 6.302

2023-03-30

Scripta Materialia

Abstract:The mechanical reliability of metallic components is vital for the stable operation of electrical equipment, especially for those used in ultra-high voltage transmission and electromagnetic launching, where metallic materials inevitably suffer from high-density current and strong magnetic field. However, little has been known about the mechanical behavior of metals under the electric-magnetic coupling stimuli. Here, by performing quantitative electromechanical tests under the built-in magnetic field inside transmission electron microscope, we found that copper, one of most commonly used conductive metals, can be significantly softened by the coupled electrical-magnetic stimuli, manifested as notable yield strength drop by five-times and obvious creep deformation at room temperature. A plausible mechanism behind the unusual softening, local-Lorentz-force-assisted dislocations depinning, has been proposed. Our results shed new light on understanding the deformation-induced failure of metals served in electromagnetic environments, and also inspire a new mechanical processing way for reshaping metals at much lower loads and temperatures.

materials science, multidisciplinary,nanoscience & nanotechnology,metallurgy & metallurgical engineering
Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Fei Jia,Leyi Niu,Yuchen Xi,Yuanying Qiu,Hongbo Ma,Chengpeng Yang

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123719

IF: 5.2

2022-12-03

International Journal of Heat and Mass Transfer

Abstract:Voids in solder joints induced by electromigration significantly affect the mechanical and electrical properties of materials, causing performance degradation and reduction in durability of electronic devices. In this study, atoms migration behavior and both voids formation and heat transfer characteristics under high current density are investigated by experiments and dynamic multiphysics simulations. In experiments, the solder joint voltage and temperature distribution are measured in situ. Besides, X-ray CT images are utilized to observe the morphology of solder joints and quantitively analyze the volume, surface area and size distribution of voids. The experimental results show that voids mainly appear in small size and distribute near the inlet of electron flow. With the increase of voids volume and area, the number of voids significantly decreases; while the number of voids falls slowly as the equivalent diameter increases. Meanwhile, a three-dimensional model combined atoms diffusion, transient heat transfer, current density, and mechanical response is developed. The model is validated by experimental results and modeling results show that atoms migrate from the cathode to the anode, causing current crowding to occur and the maximum values of tensile stress and temperature at the cathode side to locate at voids region. With the decrease of atomic concentration at the cathode, voids propagate and block the heat transfer path, leading to much uneven heat flux distribution and higher thermal resistance of the bump. Considering the effect of voids space on the microstructure of the bump, the rate of voids propagation is improved and the electromigration failure occurs earlier.

engineering, mechanical,thermodynamics,mechanics

Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field

Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation

A new prediction methodology for electromigration-induced solder degradation in a WL-CSP system

Electromagnetic–Thermo–Mechanical Coupling Behavior of Cu/Si Layered Thin Plate under Pulsed Magnetic Field

An Electro-Thermo-mechanical Coupling Phase-Field Model of Defect Evolution Induced by Electromigration in Interconnects

Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

Interaction between PCB-Cu corrosion and electrochemical migration under the Coupling of electric field and thin liquid film

A Phase-field Model of Electrochemical Migration for Silver-based Conductive Adhesives

Grain boundaries-dominated migration failure of copper interconnect under multiphysics field: Insight from theoretical modeling and finite element analysis

Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Numerical simulation study on the mold strength of magnetic mold casting based on a coupled electromagnetic-structural method

Thermomigration-induced failure in ball grid array solder joint under high current stressing

Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices

Ion migration in p-type perovskite MAPbI3 films under an electric field and thin-film transistor device failure

Experimental research on chloride migration featureduring electrochemical chloride extraction under different electric field direction

The Study of the Reliability of Complex Components during the Electromigration Process

Characteristics of Soil Pore Structure Response to Electric Field Strength and Their Effects on Cr(VI) Removal from a Historically Chromium-Contaminated Soil

Experiment on repair effect of bidirectional electromigration rehabilitation on reinforced concrete：changing rule of protective layer strength

Numerical simulation of electromigration failure in IC interconnect structures

Significant mechanical softening of copper under coupled electric and magnetic stimuli

Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density