New type of UV cured low dielectric naphthalene resin: Structure-activity relationship of different substitution sites
Zehan Lian,Zhen Lu,Rui Zhao,Longqiang Xiao,Linxi Hou
DOI: https://doi.org/10.1016/j.porgcoat.2024.108626
IF: 6.6
2024-06-27
Progress in Organic Coatings
Abstract:UV-curing low dielectric materials exhibit wide applications in the field of additive manufacturing of electronic packaging, owing to their environmental protection, good thermal stability, low dielectric constant (D k ), and dielectric loss (D f ). Wherein, one-step UV curing realizes process simplification of low dielectric materials gradually sparked widespread research. In this work, a series of novel naphthalene-based low dielectric materials were prepared for one-step UV curing. The double bond conversion rate of resins exceeds 90 % in a short time and the resins perform exceptional dielectric properties (D k < 2.8, D f < 0.009, 110 MHz), high thermal stability (T 5% > 270 °C), and hydrophobicity (water contact angle > 95°). Notably, 1,6-naphthalene dimethacrylate/Trihydroxymethylbutyl trimethylacrylate (1,6-NEA/TMPTA) suggests lowest dielectric performance (D k = 2.19, D f = 0.005) with significant thermal stability (T g = 190 °C, T 5% = 367.4 °C) because the π-π conjugation of the asymmetric structure of 1,6-NEA, which allows for a greater variety of stacking patterns and increases the effective collisions between the reactive sites of the photosensitive monomer and the reactive diluent. This work has revealed the structure-activity relationship between the substituents on naphthalene derivatives and their photochemical properties, providing a novel methodology for the development of low dielectric electronic packaging materials through additive manufacturing techniques.
chemistry, applied,materials science, coatings & films