A low-cost and monolithic flexible piezoelectric miniature ultrasonic transducer with an FPCB substrate

Changhe Sun,Changhe Sun,Changhe Sun,Wenqu Su,Yufei Liu
DOI: https://doi.org/10.1016/j.sna.2023.114289
2023-06-01
Abstract:Flexible ultrasonic transducers are highly promising devices in medical and industrial applications. However, most of them face a tension between the rigid bulk structure based on the thickness-extensional vibration mode and the flexible microstructure based on the complex micromachining process. Besides, almost all of them are difficult to be compatible with the back-end integrated circuits. This paper proposes a simple thickness-bending vibration mode based flexible piezoelectric miniature ultrasonic transducer monolithically integrated on the flexible printed circuit board substrate (FPCB-PMUT). Both the mathematical modeling and simulations are implemented to investigate the influence of structural parameters on the electromechanical and acoustic performance. A robust room-temperature adhesive bonding fabrication process is developed to achieve the desired operation frequencies and monolithic integration. Five kinds of FPCB-PMUT devices with different cavities have been fabricated and characterized in air with good consistency. The pulse-echo response experiment was also conducted to evaluate the acoustic performance. Such low requirement in assembling FPCB-PMUT devices can facilitate the development of portable ultrasonic systems and versatile ultrasonic applications.
engineering, electrical & electronic,instruments & instrumentation
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