Abstract:Thermal analysis has long been essential for designing reliable, high-performance, cost-effective integrated circuits (ICs). Increasing power densities are making this problem more important. Characterizing the thermal profile of an IC quickly enough to allow feedback on the thermal effects of tentative design changes is a daunting problem, and its complexity is increasing. The move to nanoscale fabrication processes is increasing the importance of quantum thermal phenomena such as ballistic phonon transport. Accurate thermal analysis of nanoscale ICs containing hundreds of millions of devices requires characterization of thermal effects on length scales that vary by several orders of magnitude, from nanoscale quantum thermal effects to centimeter-scale cooling package impact. Existing chip-package thermal analysis methods based on classical Fourier heat transfer cannot capture nanoscale quantum thermal effects. However, accurate device-level modeling techniques, such as molecular dynamics methods, are far too slow for use in full-chip IC thermal analysis. In this work, we propose and develop ThermalScope, a multi-scale thermal analysis method for nanoscale IC design. It unifies microscopic and macroscopic thermal physics modeling methods, i.e., the Fourier and Boltzmann transport modeling methods. Moreover, it supports adaptive multi-resolution modeling. Together, these ideas enable efficient and accurate characterization of nanoscale quantum heat transport as well as chip-package level heat flow. ThermalScope is designed for full-chip thermal analysis of billion-transistor nanoscale IC designs, with accuracy at the scale of individual devices. ThermalScope enables accurate characterization of temperature-related effects, such as variation in leakage power and delay. ThermalScope has been implemented in software and used for full-chip thermal analysis and temperature-dependent leakage analysis of an IC design with more than 150 million transistors. It will be publicly released for free academic and personal use.

Thermal Exploration of RSFQ Integrated Circuits

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

System-Level Analysis of 3D ICs with Thermal TSVs

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

ThermalScope: Multi-Scale Thermal Analysis for Nanometer-Scale Integrated Circuits

Efficient Thermal Analysis Method for Large Scale Compound Semiconductor Integrated Circuits Based on Heterojunction Bipolar Transistor

Physical Modeling And Simulation Of Thermal Heating In Vertical Integrated Circuits

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Thermal-aware electrical analysis of high-speed interconnect

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

A layout-to-simulation approach for thermal design of IC

Thermal analysis of Josephson junctions array in cryocooler

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array

Fast Thermal Analysis for Fixed-Outline 3D Floorplanning