Epoxy-silicate nanocomposites: Cure monitoring and characterization

Farzana Hussain,Jihua Chen,Mehdi Hojjati

DOI: https://doi.org/10.1016/j.msea.2006.09.071

2007-02-01

Abstract:Epoxy-clay nanocomposites were prepared with organically modified layered clay with varying clay contents (1–8wt.%). Neat resin and nanocomposite were characterized using different techniques. At first, the effect of nanoclay concentration on the cure behaviour was investigated using an on-line dielectric cure monitoring technique. Differential scanning calorimetry (DSC) was used to verify the dielectric measurement results. Furthermore, mechanical and thermal properties were studied using tensile test and Dynamic Mechanical Analysis (DMA), respectively. Experimental results showed that properties of the epoxy were changed evidently because of the nanoclay loading. The tensile modulus of the nanocomposites increased by 47%, however, no improvement in tensile strength and glass transition temperature (Tg) was observed. Fracture surface of the tensile samples were analyzed by Scanning Electron Microscope (SEM). The nanocomposites structures were characterized with Wide Angle X-Ray Diffraction (WAXD) and Transmission Electron Microscopy (TEM), which revealed the intercalated morphology of clay layers in the epoxy resin systems.