Abstract:Efficient removal of heavy metals complexed with organic ligands from water is still an important but challenging task now. Herein, a novel combined process, i.e., Fe(III)-displacement/UV degradation/alkaline precipitation (abbreviated as Fe(III)/UV/OH) was developed to remove copper organic complexes from synthetic solution and real electroplating effluent, and other processes including alkaline precipitation, Fe(III)/OH, UV/OH were employed for comparison. By using the Fe(III)/UV/OH process, some typical Cu(II) complexes, such as Cu(II) ethylenediaminetetraacetic acid (EDTA), Cu(II) nitrilotriacetic acid (NTA), Cu(II) citrate, Cu(II) tartrate, and Cu(II) sorbate, each at 19.2 mg Cu/L initially, were efficiently removed from synthetic solution with the residual Cu below 1 mg/L. Simultaneously, 30-48% of total organic carbon was eliminated with exception of Cu(II) sorbate. Comparatively, the efficiency of other processes was much lower than the Fe(III)/UV/OH process. With Cu(II) citrate as the model complex, the optimal conditions for the combined process were obtained as: initial pH for Fe(III) displacement, 1.8-5.4; molar ratio of [Fe]/[Cu], 4:1; UV irradiation, 10 min; precipitation pH, 6.6 -13. The mechanism responsible for the process involved the liberation of Cu(II) ions from organic complexes as a result of Fe(III) displacement, decarboxylation of Fe(III)-ligand complexes subjected to UV irradiation, and final coprecipitation of Cu(II) and Fe(II)/Fe(III) ions. Up to 338.1 mg/L of Cu(II) in the electroplating effluent could be efficiently removed by the process with the residual Cu(II) below 1 mg/L and the removal efficiency of similar to 99.8%, whereas direct precipitation by using NaOH could only result in total Cu(II) removal of similar to 8.6%. In addition, sunlight could take the place of UV to achieve similar removal efficiency with longer irradiation time (90 min). (C) 2015 Elsevier Ltd. All rights reserved.

In-situ CO2−/ OH redox induced by degradation intermediate organic acids realized simultaneously Cu-EDTA decomplexation and Cr(VI) reduction in a plasma process

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