Pronounced grain boundary network evolution in nanocrystalline Cu subjected to large cyclic strains

David B. Bober,Thomas LaGrange,Mukul Kumar,Timothy J. Rupert

DOI: https://doi.org/10.1557/jmr.2018.334

IF: 2.7

2018-11-13

Journal of Materials Research

Abstract:Abstract

materials science, multidisciplinary

What problem does this paper attempt to address?

Coordinated grain boundary deformation governed nanograin annihilation in shear cycling

Yingbin Chen,Qishan Huang,Qi Zhu,Kexing Song,Yanjun Zhou,Haofei Zhou,Jiangwei Wang

DOI: https://doi.org/10.1016/j.jmst.2021.01.032

2021-01-01

Abstract:Grain growth and shrinkage are essential to the thermal and mechanical stability of nanocrystalline metals, which are assumed to be governed by the coordinated deformation between neighboring grain boundaries (GBs) in the nanosized grains. However, the dynamics of such coordination has rarely been reported, especially in experiments. In this work, we systematically investigate the atomistic mechanism of coordinated GB deformation during grain shrinkage in an Au nanocrystal film through combined state-of-the-art in situ shear testing and atomistic simulations. We demonstrate that an embedded nanograin experiences shrinkage and eventually annihilation during a typical shear loading cycle. The continuous grain shrinkage is accommodated by the coordinated evolution of the surrounding GB network via dislocation-mediated migration, while the final grain annihilation proceeds through the sequential dislocation-annihilation-induced grain rotation and merging of opposite GBs. Both experiments and simulations show that stress distribution and GB structure play important roles in the coordinated deformation of different GBs and control the grain shrinkage/annihilation under shear loading. Our findings establish a mechanistic relation between coordinated GB deformation and grain shrinkage, which reveals a general deformation phenomenon in nanocrystalline metals and enriches our understanding on the atomistic origin of structural stability in nanocrystalline metals under mechanical loading. (C) 2021 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

X. Guo,X. Y. Dai,L. L. Zhu,J. Lu

DOI: https://doi.org/10.1007/s00707-013-1050-8

IF: 2.645

2014-01-01

Acta Mechanica

Abstract:Nanostructured metals with bimodal grain size distribution, composed of coarse grain (CG) and nanograin (NG) regions, have proved to have high strength and good ductility. Here, numerical investigation, based on the mechanism-based strain gradient plasticity theory and the Johnson–Cook failure model, focuses on effects of (1) distribution characteristics of the CG regions and (2) the constitutive relation of the NG with different grain sizes on fracture behavior in a center-cracked tension specimen of bimodal nanostructured Cu. High strain rate simulations show that both of them directly influence load response and energy history, and importantly, they are closely related to the fracture pattern. This study shows that both CG region bridging and crack deflection toughen the bimodal nanostructured Cu significantly, while debonding enhances the overall ductility moderately. Simulations also show that with volume fraction of the CG regions increasing, both structural strength and ductility of the bimodal nanostructured Cu specimen can be improved.
Grain boundaries dependence of plastic deformation in nanocrystalline Cu film investigated by phase field and molecular dynamics methods

Meng Zhang,Ting Xu,Liang Fang

DOI: https://doi.org/10.1016/j.matchemphys.2020.123506

IF: 4.778

2020-11-01

Materials Chemistry and Physics

Abstract:The phase filed model was used to create the nanocrystalline (NC) Cu film with more natural grain boundaries (GBs) for molecular dynamics (MD) simulation. The results obtained by using these methods are in good agreement with previous experimental results. In the NC Cu film, the plastic deformation is governed by the stacking faults (SFs) and deformation twinnings (DTs). DTs in NC Cu film have a great influence on the deformation behaviors of grains, which can make two adjacent grains merge into one larger grain, generate a new grain, and twist a grain. The model with average grain size (d) of 17.84 nm exhibits large flow stress and ductility because of the large fraction of hexagonal-close-packed (HCP) structures including SFs and twinning boundaries (TBs). Besides, the deformation of GBs in the 17.84 nm model is large, which can reduce the stress-concentration on the GBs and then results in delaying the generation of DTs. The deformation behavior of curved GBs in the initial tensile stage is that atoms migrate from face-centered cubic (FCC) structures to curved GBs along (111) surface, which is different from the shuffling motion of the flat GBs.

materials science, multidisciplinary
Arrangement and Decomposition of Grain Boundary Dislocations: Two-Mode Phase-Field Crystal Simulation

Huanqing Li,Xiaona Wang,Haibin Zhang,Xiaolin Tian,Hua Hou,Yuhong Zhao

DOI: https://doi.org/10.3389/fmats.2022.875519

2022-01-01

Frontiers in Materials

Abstract:The grain-boundary dislocation arrangement and decomposition during constant-volume deformation of a nanoscale bi-crystal system in fcc-structured materials were studied by using the two-mode phase-field crystal (2PFC) method. The effects of different grain boundary misorientations (GBMs) and tensile deformation directions on the dislocation arrangement and decomposition are analyzed. In three different symmetrical tilt grain boundaries evaluated by PFC, the atomic density profile of grain boundaries changed periodically at equilibrium. The initial grain boundary dislocation arrangement of the three samples is almost the same when tensile deformation is applied to the samples in the x- or y- direction, and all are symmetrically arranged in a “bowknot ”structure. The stress at the grain boundary is concentrated with the increase of strain, and dislocation decomposition can effectively reduce the stress concentration. The time steps of dislocation decomposition at grain boundaries decreases with increasing strain rate. This work facilitates the application of PFC in the analysis of grain-boundary mechanics in an extended range of materials.
Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Liang Zhang,Cheng Lu,Kiet Tieu,Linqing Pei,Xing Zhao,Kuiyu Cheng

DOI: https://doi.org/10.1088/2053-1591/2/3/035009

IF: 2.025

2015-03-03

Materials Research Express

Abstract:Grain boundary (GB) is the interface between different oriented crystals of the same material, and it can have a significant effect on the many properties of materials. When the average or entire range of grain size is reduced to less than 100 nm, the conventional plastic deformation mechanisms dominated by dislocation processes become difficult and GB mediated deformation mechanisms become increasingly important. One of the mechanisms that can play a profound role in the strength and plasticity of metallic polycrystalline materials is the heterogeneous nucleation and emission of dislocations from GB. In this study, we conducted molecular dynamics simulations to study the dislocation nucleation from copper bicrystal with a number of 〈1 1 0〉 tilt GBs that covered a wide range of misorientation angles (θ). We will show from this analysis that the mechanic behavior of GBs and the energy barrier of dislocation nucleation from GBs are closely related to the lattice crystallographic orientation, GB energy, and the intrinsic GB structures. An atomistic analysis of the nucleation mechanisms provided details of this nucleation and emission process that can help us to better understand the dislocation source in GB.

materials science, multidisciplinary
Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

Meng Zhang,Juan Chen,Ting Xu,Meie Li,Kun Sun,Liang Fang

DOI: https://doi.org/10.1063/1.5136326

IF: 2.877

2020-03-31

Journal of Applied Physics

Abstract:Molecular dynamics simulations are performed to study the mechanical behaviors and microstructural evolution in nanocrystalline Cu films created by the phase field model under different strain rates and temperatures. The results indicate that grain boundaries' (GBs) migration caused by shear stress difference of GBs is found in the initial deformation stage. The migration on the site with a small curvature radius of curved GBs is large due to the high stress difference. The migration process of curved GBs in the initial stage is that atoms migrate from FCC structures to GBs along the (111) surface, which is different from the mechanism of atomic shuffling for the flat GBs. Meanwhile, the initial GBs migration can make curved GBs become flat. In addition to temperature and stress difference, the hexagonal-close-packed (HCP) structures including stacking faults and twin boundaries can accelerate GBs' migration. The influence of initial GB migration on mechanical properties is achieved by changing the fraction and distribution of HCP structures. Larger initial GB migration at a higher temperature significantly reduces stress concentration on GBs, which leads to the distribution of HCP changing from the grains with large initial GB migration to other grains. Therefore, the sites of crack nucleation at conditions of low and high temperatures are different due to different magnitudes of initial GB migration.

physics, applied
Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Snehanshu Pal,K. Vijay Reddy,Chuang Deng

DOI: https://doi.org/10.1016/j.matlet.2022.132821

IF: 3

2022-07-13

Materials Letters

Abstract:Nanocrystalline metals suffer from grain growth and breakdown of the Hall-Petch-type strengthening below 20 nm due to a shift in the fundamental deformation mechanisms. Here, we designed a novel columnar nanocrystalline Cu specimen with solely coincidence site lattice (i.e., CSL Ʃ3 and Ʃ9) grain boundaries that simultaneously exhibits exceptional thermal stability and mitigates the Hall-Petch breakdown using molecular dynamics simulations. Moreover, the CSL GBs enabled continuous enhancement in strength with decreasing grain size in this specimen thus mitigating the Hall-Petch breakdown phenomenon. We believe that this study can aid in the design of ultra-strong and stable nanocrystalline metals with advanced mechanical and structural properties.

materials science, multidisciplinary,physics, applied
Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton

Meng Zhang,Kun Sun,Liang Fang

DOI: https://doi.org/10.1016/j.ijmecsci.2020.105911

IF: 7.3

2020-12-01

International Journal of Mechanical Sciences

Abstract:When the grain size is below a critical value, the deformation mechanism of nanocrystalline (NC) metal shifts from dislocation- to grain boundaries (GBs)-mediated activities. However, GB activities including deformation and rotation in the elastic and plastic stages have not given detailed analysis because of the limitation of current experimental techniques, as well as the unrealistic model with regular boundaries in most molecular dynamics (MD) simulation reducing the activities. To quantitatively analyze GB activities, we recently developed an algorithm based on moving least-squares interpolant. Besides, the phase field model was used to build the nanocrystalline (NC) Cu with more natural GBs for MD tensile simulation. The results of temperature dependence of Young's modulus (E), strain rate sensitivity (SRS), and variation of stress at GBs (σGB) and at grain interiors (σGI) are in good agreement with previous researches. In the elastic stage, the σGB fluctuates in a larger range than σGI. The vibrated σGB is the results of micro-elastic and micro-plastic deformation of GBs and the increased stage of σGB in one cycle can lead to increasing the σGI. Thus, the temperature dependence of E is affected by the frequency of vibrated σGB at relative low temperatures (T ≤ 450 K). The E is strain rate independent because of the same vibration of σGB. In the plastic stage, the flow stress strongly depends on the size of twinning boundaries (TBs) structures. The fraction of GB activities improves with increasing temperature and decreasing strain rate. GB activities can attenuate stress concentration on boundaries and then results in the formation and growth mechanism of TB changing from Shockley partial dislocation gliding on adjacent plane of stacking faults (SFs) to GB deformation. Thus, the size of TB at low temperatures and high strain rate is larger than that at the opposite conditions.

engineering, mechanical,mechanics
Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

Kai Zhou,Bin Liu,YiJun Yao,Kun Zhong

DOI: https://doi.org/10.1016/j.msea.2013.11.092

IF: 6.044

2013-01-01

Materials Science and Engineering A

Abstract:Molecular dynamics (MD) simulation has been used to study tensile deformation of nanocrystalline copper with mean grain sizes from 2.1 to 11.5nm. The flow stress, yield stress and Young's modulus are proportional to the reciprocal of the square root of grain size. They decrease as the grain size is reduced. Grain rotation and grain boundary migration are observed, which are two major causes of grain coarsening during the deformation. Notable grain coarsening is only observed at mean grain sizes below a critical grain size which is dependent on the strain rate. This coarsening is due to the extensive ordering of atoms in grain boundaries induced by grain boundary migration. Deformation twin forms much easily in very small grains.
Quantifying the influence of grain boundary activities on Hall-Petch relation in nanocrystalline Cu by using phase field and atomistic simulations

Meng Zhang,Zhaoxia Rao,Ting Xu,Liang Fang

DOI: https://doi.org/10.1016/j.ijplas.2020.102846

IF: 8.5

2020-12-01

International Journal of Plasticity

Abstract:It has been shown experimentally that the Hall-Petch relation of nanocrystalline (NC) metal will be broken down when the average grain size (d) is below a critical value, but the mechanism behind this remains to be quantitatively analyzed. In order to capture the subtle evolution of grain boundaries (GBs), we recently developed a novel algorithm by using moving least-squares (MLS) interpolant. Moreover, the phase field model is used to build NC copper with more natural and physical GBs for molecular dynamics (MD) tensile simulation. The results show that the variation of stress at GBs (σGB) and at grain interiors (σGI) in the elastic stage are in good agreement with previous study. The σGB exhibits periodic vibration, while σGI shows a linear behavior. From the stress distribution, we find that the increased σGB in one cycle can make the σGI increase. The microplasticity of GBs occurs when σGB increases to a peak value, which attenuates the stress concentration and then leads to the decrease of the σGB. Therefore, the σGI can be affected by the frequency of vibrated σGB. The fast Fourier transform (FFT) results show that the dominant frequency for the model with d of 13.8 nm is larger than that for other models, which causes a larger Young's modulus in the model. The GBs and GIs supplement each other during deformation: GBs providing an extra stress to GIs, GIs supplying the space for microplasticity of GBs. Besides, the fraction of deformed GBs and rotated GBs in the model are also large. GB activities are the results of overall microplasticity before σGB = σGI and deformation during the plastic stage. The rotated GBs results in the emission of many Shockley partial dislocation (partials) from GBs since they create larger paths for dislocation movement. Thus, many twinning boundaries (TBs) are generated in the model with d of 13.8 nm by partials gliding on the successive plane of adjacent stacking faults (SFs) structures, which plays an important role in work hardening of NC Cu.

materials science, multidisciplinary,engineering, mechanical,mechanics
Grain Boundary Structure Dependent Fracture in Nanocrystalline Au Films

Jiabin Liu,Anmin Nie,Cezhou Dong,Peng Wang,Hongtao Wang,Maosen Fu,Wei Yang

DOI: https://doi.org/10.1016/j.matlet.2011.05.095

IF: 3

2011-01-01

Materials Letters

Abstract:Nanocrystalline Au films were in situ strained in a high resolution transmission electron microscope, which demonstrated that the diffusion-assisted intergranular fracture was the dominant failure mode. Grain orientation with respect to grain boundaries (GBs) imposes important effect on the crack propagation and blunting. The low surface energy and high diffusion mobility of {111} planes lead to a notch-like crack. The stress concentration at the tip may help breaking {111} planes layer by layer and thus advance the crack. Cracks can be diverted from the preset path by GBs and grow into the grain interior, which has never been revealed by other experiments and molecular dynamics simulations.
Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Junxia Lu,Qi Zhu,Jin Wang,Hua Wei,Jiangwei Wang,Yuefei Zhang,Ze Zhang

DOI: https://doi.org/10.1016/j.mtla.2021.101116

2021-01-01

Materialia

Abstract:Crack dynamics typically controls the deformation and fracture of nanocrystalline (NC) metallic materials, while the ubiquitous interplay between nanograins and propagating cracks remains unclear. Here, using in situ nanomechanical testing inside transmission electron microscope, we clarify the atomistic interplay between GB evolution and crack propagation in NC silver (Ag) thin films, where the cooperative GB migration, GB re-orientation and nanograin nucleation activated ahead of the crack tip result in conspicuous crack blunt. This grain-crack interplay is critically facilitated by the diffusive plasticity associated with crack propagation, which yields dynamically modified crack tip morphology and rate-limiting intragranular cracking. These atomistic mechanisms of diffusive crack-grain interplay enrich our understanding of the cooperative deformation behaviors in nanograin regime and hold general implications to enhance the fracture resistance of NC metallic materials.
Analysis of grain boundary networks and their evolution during grain boundary engineering

Christopher A. Schuh,Mukul Kumar,Wayne E. King

DOI: https://doi.org/10.1016/s1359-6454(02)00447-0

IF: 9.4

2003-02-01

Acta Materialia

Abstract:The goal of grain boundary engineering is to increase the fraction of so-called special grain boundaries, while decreasing the contiguity of the remaining random boundaries which are susceptible to intergranular degradation such as cracking, cavitation, corrosion and rapid self-diffusion. In the present work, we describe a technique for the quantitative experimental study of grain boundary network topology, with an emphasis on the connectivity of special and random grain boundaries. Interconnected grain boundary networks, or “clusters”, of either entirely random or entirely special boundaries are extracted from electron backscatter diffraction data on a Ni-base alloy, and characterized according to their total normalized length (their “mass”), as well as their characteristic linear dimensions. The process of grain boundary engineering, involving cycles of straining and annealing, is found to substantially reduce the mass and size of random boundary clusters. Furthermore, quantitative assessment of the boundary network topology shows that the special grain boundary fraction is a poor predictor of network topology, but that the higher-order correlation derived from triple junction distributions can successfully describe the length scales of random boundary clusters.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Strain localization in a nanocrystalline metal: Atomic mechanisms and the effect of testing conditions

Timothy J. Rupert

DOI: https://doi.org/10.48550/arXiv.1407.5927

2014-07-23

Abstract:Molecular dynamics simulations are used to investigate strain localization in a model nanocrystalline metal. The atomic mechanisms of such catastrophic failure are first studied for two grain sizes of interest. Detailed analysis shows that the formation of a strain path across the sample width is crucial, and can be achieved entirely through grain boundary deformation or through a combination of grain boundary sliding and grain boundary dislocation emission. Pronounced mechanically-induced grain growth is also found within the strain localization region. The effects of testing conditions on strain localization are also highlighted, to understand the conditions that promote shear banding and compare these observations to metallic glass behavior. We observed that, while strain localization occurs at low temperatures and slow strain rates, a shift to more uniform plastic flow is observed when either strain rate or temperature is increased. We also explore how external sample dimensions influence strain localization, but find no size effect for the grain sizes and samples sizes studied here.

Materials Science,Mesoscale and Nanoscale Physics
Grain boundary complexions and the strength of nanocrystalline metals: Dislocation emission and propagation

Vladyslav Turlo,Timothy J. Rupert

DOI: https://doi.org/10.48550/arXiv.1712.02829

2018-03-26

Abstract:Grain boundary complexions have been observed to affect the mechanical behavior of nanocrystalline metals, improving both strength and ductility. While an explanation for the improved ductility exists, the observed effect on strength remains unexplained. In this work, we use atomistic simulations to explore the influence of ordered and disordered complexions on two deformation mechanisms which are essential for nanocrystalline plasticity, namely dislocation emission and propagation. Both ordered and disordered grain boundary complexions in Cu-Zr are characterized by excess free volume and promote dislocation emission by reducing the critical emission stress. Alternatively, these complexions are characterized by strong dislocation pinning regions that increase the flow stress required for dislocation propagation. Such pinning regions are caused by ledges and solute atoms at the grain-complexion interfaces and may be dependent on the complexion state as well as the atomic size mismatch between the matrix and solute elements. The trends observed in our simulations of dislocation propagation align with the available experimental data, suggesting that dislocation propagation is the rate-limiting mechanism behind plasticity in nanocrystalline Cu-Zr alloys.

Materials Science,Mesoscale and Nanoscale Physics
Quantitative tracking of grain structure evolution in a nanocrystalline metal during cyclic loading

Jason F. Panzarino,Jesus J. Ramos,Timothy J. Rupert

DOI: https://doi.org/10.1088/0965-0393/23/2/025005

2014-10-15

Abstract:Molecular dynamics simulations were used to quantify mechanically-induced structural evolution in nanocrystalline Al with an average grain size of 5 nm. A polycrystalline sample was cyclically strained at different temperatures, while a recently developed grain tracking algorithm was used to measure the relative contributions of novel deformation mechanisms such as grain rotation and grain sliding. Sample texture and grain size were also tracked during cycling, to show how nanocrystalline plasticity rearranges overall grain structure and alters the grain boundary network. While no obvious texture is developing during cycling, the processes responsible for plasticity act collectively to alter the interfacial network. Cyclic loading led to the formation of many twin boundaries throughout the sample as well as the occasional coalescence of neighboring grains, with higher temperatures causing more evolution. A temperature-dependent cyclic strengthening effect was observed, demonstrating that both the structure and properties of nanocrystalline metals can be dynamic during loading.

Materials Science,Mesoscale and Nanoscale Physics
Dislocation-assisted grain growth in nanocrystalline copper under large deformation

Xin Ling Ma,Wei Yang

DOI: https://doi.org/10.1016/j.scriptamat.2008.06.022

IF: 6.302

2008-01-01

Scripta Materialia

Abstract:Dislocation plasticity conventionally induces textures in polycrystalline metals after a large deformation. We used parallel molecular dynamics to simulate the plastic deformation of nanocrystalline copper to an isochoric stretch up to 100% logarithmic strain. We found that the movements of partial dislocations that dominate the deformation process do not lead to texture formation. The grain size distribution becomes extremely inhomogeneous. By observing the structural evolution, we demonstrate that grain growth assisted by partial dislocations suppresses the texture formation. Crown Copyright (c) 2008 Published by Elsevier Ltd. on behalf of Acta Materialia Inc. All rights reserved.
A Study of Strain-Driven Nucleation and Extension of Deformed Grain: Phase Field Crystal and Continuum Modeling

Ling-yi Kong,Ying-jun Gao,Qian-qian Deng,Zhi-rong Luo,Yu-jiang Lu

DOI: https://doi.org/10.3390/ma11101805

IF: 3.4

2018-09-23

Materials

Abstract:The phase-field-crystal (PFC) method is used to investigate migration of grain boundary dislocation and dynamic of strain-driven nucleation and growth of deformed grain in two dimensions. The simulated results show that the deformed grain nucleates through forming a gap with higher strain energy between the two sub-grain boundaries (SGB) which is split from grain boundary (GB) under applied biaxial strain, and results in the formation of high-density ensembles of cooperative dislocation movement (CDM) that is capable of plastic flow localization (deformed band), which is related to the change of the crystal lattice orientation due to instability of the orientation. The deformed grain stores the strain energy through collective climbing of the dislocation, as well as changing the orientation of the original grain. The deformed grain growth (DGG) is such that the higher strain energy region extends to the lower strain energy region, and its area increase is proportional to the time square. The rule of the time square of the DGG can also be deduced by establishing the dynamic equation of the dislocation of the strain-driven SGB. The copper metal is taken as an example of the calculation, and the obtained result is a good agreement with that of the experiment.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
Revealing the size effect mechanism of reversible grain boundary migration in nanocrystalline coppers: Molecular dynamics simulations and a refined disconnection model

Anping Hua,Junhua Zhao,Jian Zhang,Peishi Yu,Ning Wei,Wanlin Guo

DOI: https://doi.org/10.1016/j.jmps.2022.104832

IF: 5.582

2022-04-01

Journal of the Mechanics and Physics of Solids

Abstract:Reversible grain boundary (GB) migration is of great significance for promoting cyclic deformability and has been observed in nanocrystalline metals. However, GBs as dislocation sources generally emit more dislocations under deformation with increasing grain sizes. The size effect mechanism of reversible GB migration is thus crucial but remains unknown. We demonstrate that the reversibility of the representative Σ11(113) GB migration in copper (Cu) bicrystals under cyclic shear strongly depends on their grain sizes using molecular dynamics (MD) simulations. Atomic observation of the GB plane reveals the transition mechanism from the fully reversible disconnection-mediated GB migration to the disconnection pair grooving (DPG) induced irreversible structural damage with increasing grain size (d), where the disconnections at the groove are proved to be screw disconnections with Burgers vectors of 1/22[332(−−−)] using Burgers circuit and lattice analysis. A refined disconnection model considering grain size is developed to predict disconnection-mediated GB migration behavior and interpret the forming mechanism of DPG. When satisfying d > 1.6651Gb/πτ (shear modulus G, Burgers vector b, and shear stress τ), the DPG mode is triggered, while the single disconnection sliding provokes the reversible GB migration when d ≤ 1.6651Gb/πτ. This study holds implications for nanocrystalline metals towards endurable cyclic deformability by controllable grain sizes.

mechanics,materials science, multidisciplinary,physics, condensed matter
In situ atomic-scale observation of dislocation climb and grain boundary evolution in nanostructured metal

Shufen Chu,Pan Liu,Yin Zhang,Xiaodong Wang,Shuangxi Song,Ting Zhu,Ze Zhang,Xiaodong Han,Baode Sun,Mingwei Chen

DOI: https://doi.org/10.1038/s41467-022-31800-8

2022-07-18

Abstract:Non-conservative dislocation climb plays a unique role in the plastic deformation and creep of crystalline materials. Nevertheless, the underlying atomic-scale mechanisms of dislocation climb have not been explored by direct experimental observations. Here, we report atomic-scale observations of grain boundary (GB) dislocation climb in nanostructured Au during in situ straining at room temperature. The climb of a edge dislocation is found to occur by stress-induced reconstruction of two neighboring atomic columns at the edge of an extra half atomic plane in the dislocation core. This is different from the conventional belief of dislocation climb by destruction or construction of a single atomic column at the dislocation core. The atomic route of the dislocation climb we proposed is demonstrated to be energetically favorable by Monte Carlo simulations. Our in situ observations also reveal GB evolution through dislocation climb at room temperature, which suggests a means of controlling microstructures and properties of nanostructured metals.

Pronounced grain boundary network evolution in nanocrystalline Cu subjected to large cyclic strains

Coordinated grain boundary deformation governed nanograin annihilation in shear cycling

Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Grain boundaries dependence of plastic deformation in nanocrystalline Cu film investigated by phase field and molecular dynamics methods

Arrangement and Decomposition of Grain Boundary Dislocations: Two-Mode Phase-Field Crystal Simulation

Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton

Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

Quantifying the influence of grain boundary activities on Hall-Petch relation in nanocrystalline Cu by using phase field and atomistic simulations

Grain Boundary Structure Dependent Fracture in Nanocrystalline Au Films

Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Analysis of grain boundary networks and their evolution during grain boundary engineering

Strain localization in a nanocrystalline metal: Atomic mechanisms and the effect of testing conditions

Grain boundary complexions and the strength of nanocrystalline metals: Dislocation emission and propagation

Quantitative tracking of grain structure evolution in a nanocrystalline metal during cyclic loading

Dislocation-assisted grain growth in nanocrystalline copper under large deformation

A Study of Strain-Driven Nucleation and Extension of Deformed Grain: Phase Field Crystal and Continuum Modeling

Revealing the size effect mechanism of reversible grain boundary migration in nanocrystalline coppers: Molecular dynamics simulations and a refined disconnection model

In situ atomic-scale observation of dislocation climb and grain boundary evolution in nanostructured metal