Abstract:It has been shown experimentally that the Hall-Petch relation of nanocrystalline (NC) metal will be broken down when the average grain size (d) is below a critical value, but the mechanism behind this remains to be quantitatively analyzed. In order to capture the subtle evolution of grain boundaries (GBs), we recently developed a novel algorithm by using moving least-squares (MLS) interpolant. Moreover, the phase field model is used to build NC copper with more natural and physical GBs for molecular dynamics (MD) tensile simulation. The results show that the variation of stress at GBs (σGB) and at grain interiors (σGI) in the elastic stage are in good agreement with previous study. The σGB exhibits periodic vibration, while σGI shows a linear behavior. From the stress distribution, we find that the increased σGB in one cycle can make the σGI increase. The microplasticity of GBs occurs when σGB increases to a peak value, which attenuates the stress concentration and then leads to the decrease of the σGB. Therefore, the σGI can be affected by the frequency of vibrated σGB. The fast Fourier transform (FFT) results show that the dominant frequency for the model with d of 13.8 nm is larger than that for other models, which causes a larger Young's modulus in the model. The GBs and GIs supplement each other during deformation: GBs providing an extra stress to GIs, GIs supplying the space for microplasticity of GBs. Besides, the fraction of deformed GBs and rotated GBs in the model are also large. GB activities are the results of overall microplasticity before σGB = σGI and deformation during the plastic stage. The rotated GBs results in the emission of many Shockley partial dislocation (partials) from GBs since they create larger paths for dislocation movement. Thus, many twinning boundaries (TBs) are generated in the model with d of 13.8 nm by partials gliding on the successive plane of adjacent stacking faults (SFs) structures, which plays an important role in work hardening of NC Cu.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the influence mechanism of grain - boundary activities on the Hall - Petch relationship in nanocrystalline copper (NC Cu). Specifically, when the average grain size (\(d\)) is below a certain critical value, it has been experimentally observed that the Hall - Petch relationship of nanocrystalline metals will fail, but the mechanism behind this phenomenon has not yet been quantitatively analyzed. By using the phase - field model and atomic simulations, the paper aims to capture the subtle evolution of grain - boundary activities, thereby explaining the reasons for the failure of the Hall - Petch relationship at small grain sizes. The main research contents of the paper include: 1. **The relationship between grain - boundary stress vibration and the linear behavior of intra - grain stress**: The paper finds that in the elastic stage, the stress at the grain boundary (\(\sigma_{GB}\)) shows periodic vibration, while the intra - grain stress (\(\sigma_{GI}\)) shows a linearly increasing behavior. In each vibration cycle, the increase in \(\sigma_{GB}\) will lead to an increase in \(\sigma_{GI}\). 2. **Micro - plasticity mechanism**: When \(\sigma_{GB}\) reaches its peak, the micro - plastic activities at the grain boundary begin to occur, which will weaken the stress concentration and cause \(\sigma_{GB}\) to decrease. Therefore, \(\sigma_{GI}\) is affected by the vibration frequency of \(\sigma_{GB}\). 3. **Interaction between grain boundary and intra - grain**: During the deformation process, the grain boundary provides additional stress to the intra - grain, and the intra - grain provides space for the micro - plastic activities of the grain boundary. This interaction leads to changes in the mechanical properties of the material. 4. **Grain - boundary rotation and dislocation emission**: The rotation of the grain boundary will cause many Shockley partial dislocations (partials) to be emitted from the grain boundary. These dislocations slide on the adjacent stacking - fault - structure planes, generating many twin - boundaries (TBs), which play an important role in the work - hardening of nanocrystalline copper. In conclusion, through detailed simulations and analyses, this paper reveals the influence mechanism of grain - boundary activities on the mechanical properties of materials in nanocrystalline copper, especially how grain - boundary activities lead to the failure of the Hall - Petch relationship at small grain sizes.

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