Understanding atomic interaction between cuprous oxide film and aggressive chloride solution

Zhongheng Fu,Xinzheng Zhang,Xin Guo,Dominik Legut,Dawei Zhang
DOI: https://doi.org/10.1016/j.corsci.2023.111718
IF: 7.72
2023-11-29
Corrosion Science
Abstract:Considering the structural complexity of actual copper (Cu) passive films consisting of Cu 2 O, the multiple roles of aggressive chloride anion (Cl – ) on Cu 2 O are revealed through first-principles calculations. Despite different Cl – adsorption susceptibilities of various Cu 2 O surfaces, similar surface O vacancy formation mechanisms promoted by Cl – adsorption are elucidated, accompanying with further Cu vacancy propagation. Increasing surface Cu vacancy concentration and unchanged Cu vacancy diffusion coefficient induced by Cl – adsorption lead to increasing diffusion flux. These results reveal the atomic interaction between Cu 2 O film and Cl ion, which is helpful to understand the depassivation mechanism of Cu.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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