Investigation of thermal annealing on the characteristics of Sc Al1−N thin films

Chao Gao,Yao Cai,Yang Zou,Binghui Lin,Tingting Yang,Yaxin Wang,Yan Liu,Shishang Guo,Chengliang Sun
DOI: https://doi.org/10.1016/j.vacuum.2023.112669
IF: 4
2024-01-01
Vacuum
Abstract:Good temperature stability is essential for radio-frequency (RF) devices working at high frequencies. AlN and Sc doped AlN (Sc x Al1−x N) are widely used as piezoelectric thin films for their excellent performance, but the temperature characteristics of these two materials could be more precise. In this work, the effect of high-temperature thermal annealing on the characteristics of Sc x Al1−x N thin films was investigated. Sc x Al1−x N thin films with different Sc compositions were deposited and then annealed in different atmospheres at various temperatures. It was found that Sc x Al1−x N thin films could maintain good temperature stability below 900 °C in vacuum or air, and AlN can even maintain up to 1300 °C under vacuum. When the annealing temperature exceeded 900 °C, the films’ crystallinity and lattice would appear to have apparent changes. Moreover, the introduction of oxygen at elevated temperatures could impair the surface morphologies and mechanical properties of the Sc x Al1−x N thin films. The results revealed that the increased Sc composition decreased the temperature stability of the Sc x Al1−x N thin films, and AlN was proved to have better temperature stability than the other two thin films. This work establishes a research foundation for utilizing Sc x Al1−x N thin films in high-temperature applications.
materials science, multidisciplinary,physics, applied
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