Effects of using nanofluids on thermal performance and mass transfer in a micro-flat plate heat pipe

Gholamreza Ahmadi,Ali Jahangiri,Mohammad Ameri,Davood Toghraie
DOI: https://doi.org/10.1007/s10973-024-12898-y
IF: 4.755
2024-02-20
Journal of Thermal Analysis and Calorimetry
Abstract:Managing the heat generated in equipment such as microprocessors requires optimal thermal design. As a type of superconductor, heat pipes (HPs) are a suitable choice for this purpose. The performance of micro-HPs can be affected by the body material and working fluid, among other parameters. The present paper examines the use of a nanofluid inside a flat plate micro-HP under various working conditions. Platinum (Pt), copper (Cu), and aluminum (Al) were used as body materials and argon (Ar), ethanol (Eth), and water (H 2 O) were used as the working fluid. The effect of adding 5, 10, and 15 nanoparticles (NPs) of the same substance as the body was also studied. Given the scale of the problem (maximum length of 1 μm), a molecular dynamic (MD) simulation was performed. First, the results were validated, and then the performance of the HP was examined under various conditions. According to the results, increasing the number of nanoparticles helped improve thermal performance. The highest heat flux corresponded to Cu–Eth and was equal to 2092 W/cm 2 . On the other hand, the highest heat flux for Pt was obtained using Eth and equaled 1992 W/cm 2 . The highest and lowest mass transfer rates are achieved using Ar and H 2 O at 40 % and 26 %, respectively. Increasing the number of nanoparticles from 5 to 15 np in Pt–Eth led to a 23.5 % rise in the heat flux. Cu has the highest evaporation and condensation rate among the metals under study. The findings of this study can help for a better understanding of the working condition of micro-HPs on a molecular scale, which helps better design such devices in the electronic industry. It should be noted that the results are validated using different methods.
chemistry, physical, analytical,thermodynamics
What problem does this paper attempt to address?