Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

Xu Hao,Shiqin Wan,Zheng Zhao,Lifeng Zhu,Dongyao Peng,Ming Yue,Jianlei Kuang,Wenbin Cao,Guanghua Liu,Qi Wang
DOI: https://doi.org/10.1021/acsami.2c18356
2022-12-30
Abstract:With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was...
materials science, multidisciplinary,nanoscience & nanotechnology
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