Construction of AlN oriented skeletons using in-situ reaction strategy and their enhancement effect on the thermal conductivity of epoxy composites

Chang Yu,Baokai Wang,Mengyi Li,Mengyang Niu,Qipeng Lu,Weiwei Xuan,Lifeng Zhu,Ming Yue,Wenbin Cao,Qi Wang

DOI: https://doi.org/10.1016/j.compscitech.2024.110565

IF: 9.1

2024-05-01

Composites Science and Technology

Abstract:The development of electronic devices towards miniaturization and integration has put forward higher requirements for polymer-based composites with high thermal conductivity (TC). Aluminum nitride (AlN) is one of the most promising fillers thanks to its high TC (∼320 W m−1 K−1) and outstanding physicochemical properties. However, the traditional composites filled with randomly dispersed AlN particles generally require extremely high filling fraction to enhance the TC, leading to increased production cost and degraded mechanical performance. To address this issue, an innovative strategy combining freezing casting and in-situ reaction process was proposed to directly construct vertically aligned AlN skeletons, which was further used as reinforcements to enhance the TC of epoxy (EP) composites. The close arrangement of AlN particles along the vertical direction was not only beneficial for enhancing the TC, but also improving the mechanical strength. The AlN/EP composites achieved an extremely high TC of ∼8.25 W m−1 K−1 at the AlN filling fraction of 56.2 vol%, which was 45.83 times higher than that of pure EP. The actual thermal management applications and finite element simulations also demonstrated the oriented AlN skeletons exhibited a more significant TC enhancement than that of randomly arranged AlN. Furthermore, the as-prepared AlN/EP composites also exhibited superior thermal stability and dielectric properties, presenting a broad application prospect as thermal management materials for the next-generation electronic devices.

materials science, composites