Abstract:New electronic systems for automation/industrial controlling/medicine/aerospace will continue to challenge both packaging engineers and technology due to the increased performance requirements,higher densities,higher temperatives and limited space available.This challenge mandates the use of unique packaging techniques such as Low Temperature Co-fired Ceramic(LTCC) technology that not only provide the increase circuit density but also the reliability,electrical and transfer performance,thermal management,and hermeticity.Low Temperature Co-fired Ceramic(LTCC) technology is a new packaging technology for integrate circuit,which consists of buried passive devices such as transformer,conductors,resistors,and capacitors in the multilayer of module and can easily integrate with active devices such as power MOS,transistors,and IC module.Recently,this technology was widely focused and researched for its wonderful properties.Focused on the LTCC materials,some researches were carried as follows: 1.A low temperature sintering model was established based on the liquid sintering theories.The sintering temperature and sintering time dependence of relative density for the sintered ceramics were simulated.2.With the systemically analyses of the synthesis of ferroelectric-ferromagnetic composite materials,the low temperature sintered NiCuZn ferrites and perovskite BaTiOk+X was chosen as the main components.A model was given by assuming the isolation of magnetic grains by surrounding non-magnetic layer to evaluate the internal field and the complex permeability of whole material as a function of the ratio of perovskite content to ferrite content.3.The effects of preparation process on the microstructure and electromagnetic properties of ceramics are researched.The pre-sintering temperature,milling time,firing rate,sintering temperature,and holding time are changed regularly to investigate the variation of the phase formation by X-ray diffraction studies,the micrographs of the sintered ceramics by SEM,and the bulk density by Archimedes method.The frequency dependence of complex permeability,quality factor,and dielectric constant are studied.4.The effects of sintering temperature and Mn ions contents on the microstructure and electromagnetic properties of NiZn ferrites are studied.To decreased the sintering temperature,CuO was introduced in NiZn ferrites first,and then the flux oxides such as Bi2O3,WO3,and Nb2O5 are introduced in NiCuZn ferrites.The variation of microstructure and electromagnetic properties with these reducing-sintering-temperature oxides’ content are investigated.Finally,the influence of rare earth ions Ce4+ on low temperature sintered NiCuZn ferrites are researched.5.A new ferroelectric-ferromagnetic composite material is synthesized by usual ceramic technology with NiCuZn ferrites and perovskite BaTiOk+X as the main components.The microstructure and electromagnetic properties of the composite with different composition of NiCuZn ferrites and different perovskite contents are investigated.After that,the influences of flux oxide Bi2O3,WO3,and Nb2O5 and the Ca2+,Ce4+ ions on this composite material are also studied.6.A LTCC band pass filter is designed with this composite material using the Ansoft HFSS software.This filter has insertion loss in the pass band 2.8 dB,the attenuation losses in the stopband were more than 30 dB,the centre frequency of the pass band is 1.4 GHz and the 3 dB band width is more than 160 MHz.

LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes–Design Optimization Using CFD

Modeling Of Two-Dimensional Dynamic Temperature Distribution Of A Lpcvd Process And Control Design By Mpc

2D Computational Fluid Dynamics Simulation Analysis of the Assembly of Low‐Temperature Cofired Ceramics/Low‐Temperature Cofired Ceramics and Si/Si Sandwiches by Reactive Bonding

Cutting Temperature and Force Data Acquisition and Measuring System Design in High Speed Machining

In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface

Temperature measurement of wafers with varying multilayer structures during rapid thermal annealing

Thermal Based Process Monitoring for Laser Powder Bed Fusion (LPBF)

Large Thermal Expansion LTCC System for Cofiring with Integrated Functional Ceramics Layers

Inkjet-printed Low Temperature Co-fired Ceramics: Process development for customized LTCC

Measurement of Temperature Inside Die and Estimation of Interfacial Heat Transfer Coefficient in Squeeze Casting

Cofiring of LTCC multilayer assemblies with integrated NTC thermistor temperature sensor layers

Influence of part temperature on in-situ monitoring of powder bed fusion of metals using eddy current testing

Thermal and dynamic characteristics in the corners of LPBF-fabricated TC4 multi-track parts and the impact of contour scanning

Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method

Optimization of LTCC Multilayer Interconnect Substrate Process

Study on Composite LTCC Materials

Improving the accuracy and reliability of temperature field simulation during laser metal deposition

The Study of Packaging Substrate Effect in FCBGA by Laser Assisted Bonding

A Capacitive Pressure Sensor Based on LTCC/PDMS Bonding Technology

Development of Low-Temperature Bonding Platform Using Ultra-Thin Area Selective Deposition for Heterogeneous Integration

The Array-Control Heater and Non-Uniform Resistance Module Design for Regulating the Temperature Profile in A Reactor Chamber