Design of high thermal conductivity insulation adhesive (H-class) for low voltage motor

Xiaoquan Zheng,Chenyang Liu,Mo Yin,X. Cheng
DOI: https://doi.org/10.1109/TDEI.2016.7556461
IF: 2.509
2016-09-08
IEEE Transactions on Dielectrics and Electrical Insulation
Abstract:In order to reduce the winding temperature furthest, we adopted the method of adding micron-grade filler to ET-90 base resin, and prepared three kinds of modified high-thermal conductivity adhesive specimens (H-Class). At the same time, four kinds of performance tests (water-absorption, adhesive-strength, breakdown-strength, thermal conductivity) had been done for them, the test results showed specimen III adhesive had a highest thermal-conductivity (0.31 W/m<;/sup>.<;/sup>K), and finally specimen III adhesive was selected for testing. A new insulating system was developed, it consists of specimen III adhesive, self-made slot wedges and insulating paper. We applied the new insulating system to motors, and observed the changing results of winding temperature and no load loss. The results showed that the winding temperature could decrease by about 7 K from before, the no-load loss also has a decrease correspondingly. In the meantime, the motor efficiency increases by 0.7% compared to the original state and improves to nearly 86.6%. Thus, this research indicates that this new high thermal-conductivity adhesive (H-Class) could lower temperature in the windings and improve the motor efficiency simultaneously, it is of great significance in practical application.
Materials Science,Engineering
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