Development of electroforming technology for flexible metal substrates for high-efficiency double-sided electronic devices

Sung-Ki Min,Sung-Nam Lee,Moojin Kim,Kyoung-Bo Kim
DOI: https://doi.org/10.1016/j.mtcomm.2024.108784
IF: 3.8
2024-04-11
Materials Today Communications
Abstract:In this study, we investigate a novel material that surpasses conventional concepts used for substrate materials in flexible electronic devices. Unlike traditional materials, this novel material can replace polymers with a metallic substance. This substance is capable of supporting electronic devices on both sides. Our development focuses on a metallic substrate material based on Fe-Ni. This material allows for the implementation of secondary batteries on its extremely flat opposite side through the electroforming method. The Fe (Iron)-Ni (Nickel) material produced by electroforming shows superior characteristics in terms of coefficient of thermal expansion (CTE) and mechanical properties. This superiority is due to its finer grain size, compared to Fe-Ni produced by the rolling process. Furthermore, when we use the Fe-Ni material to manufacture secondary batteries, it demonstrates equivalent or superior battery characteristics compared to the conventional aluminum (Al) collector material. During thermal shock tests, the Fe-Ni material also shows superior adhesion compared to the traditional Al collector. This advantage is attributed to Fe-Ni's low CTE. Our approach enables the implementation of secondary batteries for power generation on one side and the manufacture of electronic components for power consumption on the other. This creates a new concept for flexible substrate materials.
materials science, multidisciplinary
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