Abstract:Neuromorphic computing that physically mimics human brain, is considered as one of the rebooting computing frontiers, promising in far-reaching applications like machine learning. Progress in research on memristor-based synapses has far exceeded that on neurons and interconnects. Also as the essential parts in physical implementation of brain-inspired computing, neuron circuit cell and interconnects may both greatly benefit from the high flexibility and parallelism of 3D heterogeneous integration technologies based on TSV (through semiconductor/substrate via). In this paper, a 3D circuit cell mimicking a brain neuron is first proposed, featuring TSVs with cross-sections distinct from those for signal or power transmission between device strata. These so- called "neural TSVs", with co-axial Cu filling, oxide liners and N+ doped outer plate, are used as input coupling capacitors to a MOS transistor on the same Si active interposer or that on a chip surface-mounted onto a passive interposer. TSVs and the transistor together compose a neuron MOSFET, which acts as a capacitive threshold summator and is further combined with a CMOS inverter to create a 3D neuron circuit cell. Analytical models are established, and electromagnetic field simulations are used to reveal the parasitics. Then, the behavior of the design is analyzed with HSPICE simulators. At last, a Rosenblatt perceptron is designed to demonstrate the network-level functionality of the neuron cell. A further integration of the discussed neuron circuit cell, memristor synapses, and 3D TSV-based interconnects may enable a highly intricate and flexible 3D network, implementing a brain-inspired 3D SoC.

Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN

Inverse Design of On-Chip Interconnect via Transfer Learning-Based Deep Neural Networks

Modeling and Characterization of On‐Chip Interconnects

Modeling and Characterization of Carbon-Based Heterogeneous Interconnects for 3-D Ics

A Physics-Informed Neural Networks Algorithm for Simulating Semiconductor Devices

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

Deep Neural Network-Based Surrogate-Assisted Inverse Optimization for High-Speed Interconnects

Hybrid Signal Integrity Modeling and Analysis of Heterogeneous Integrated System with Neuromorphic Darwin Chip

Analysis of Neural Spike Signal Transmission Characteristics in 3-D Heterogeneous Integration

Signal Integrity Analysis of Neuronal Spike Signal in 3-D Packaging

Modeling and Design of A 3D Interconnect Based Circuit Cell Formed with 3D SiP Techniques Mimicking Brain Neurons for Neuromorphic Computing Applications

Modular Neural Network-Based Models of High-Speed Link Transceivers

Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links

Modeling and Simulation of Nano-Interconnects for Nanophotonics

Modeling Cascade-able Transceiver Blocks with Neural Network for High Speed Link Simulation

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Knowledge-based neural network SPICE modeling for MOSFETs and its application on 2D material field-effect transistors

Electrical Simulation and Analysis of Si Interposer for 3d Ic Integration

A 3D Convolutional Network for Fast and Accurate S/Z-Parameters Prediction of Si-Interposer Power Distribution Network With Through Silicon Vias

Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology

Modeling and Design of Power Distribution Network for a Heterogeneous Integrated Active Interposer with Neuromorphic Computing Circuits