Abstract:The structure of nanomaterials and nanodevices determines their functionality and applications. A single uniform nanochannel with a high aspect ratio is an attractive structure due to its unique rigid structures, easy preparation, and diverse pore structures and it holds significant promising importance in fields such as nanopore sensing and nanomanufacturing. Although the metal-nanoparticle-assistant silicon etching technique can produce uniform nanochannels, however, the fabrication of single through nanochannels remains a challenge thus far. A simple and versatile strategy is developed that allows for the retention of individual gold nanoparticle on a substrate, enabling single-nanoparticle nanomachining. This method involves three steps: the formation of a carbon protective layer on individual nanoparticles via electron-beam irradiation, selective removal of unprotected nanoparticles using a corrosive agent, and subsequent elimination of the carbon layer. This enables the fabrication of a single submillimeter-long uniform through nanochannel in the silicon wafer, which can be employed for nanopore sensing and shape-based nanoparticle distinguishing. The developed method can also facilitate single-nanoparticle studies and nanomachining for a broad application in materials science, electronics, micro/nano-optics, and catalysis. The retention of individual gold nanoparticles on a substrate, enabling single-nanoparticle nanomachining, is enabled via a simple and versatile strategy. This method involves three steps: the formation of a carbon protective layer on individual nanoparticle via electron-beam irradiation, selective removal of unprotected nanoparticles using a corrosive agent, and subsequent elimination of the carbon layer. This enables the fabrication of a single micrometer-long uniform through nanochannel in the silicon wafer, which can be employed for nanopore sensing and shape-based nanoparticle distinguishing.image

Single-step and parallel high-speed fabrication for Au micro-/nanostructures

Large-Area Patterning of Metal Nanostructures by Dip-Pen Nanodisplacement Lithography for Optical Applications.

Solution-processible fabrication of large-area patterned and unpatterned gold nanostructures.

Fabrication of Single Gold Particle Arrays with Pattern Directed Electrochemical Deposition.

An Anti-Ultrasonic-stripping Effect in Confined Micro/nanoscale Cavities and Its Applications for Efficient Multiscale Metallic Patterning.

High‐resolution patterning of conductive microstructures by electrostatic deposition of aerosol Au nanoparticles through the dielectric mask

Sustainable Fabrication and Transfer of High‐Precision Nanoparticle Arrays Using Recyclable Chemical Pattern Templates

Particle Lithography-Based Patterning of Polyelectrolyte Template Films and Their Application in Fabrication of Gold/silver Nanoparticle Assembly.

Fabricating Au micro-pattern arrays on flexible substrate with high fidelity

Facile fabrication of a single-particle platform with high throughput via substrate surface potential regulated large-spacing nanoparticle assembly

Arbitrary Gold Nanoparticle Arrays Fabricated Through AFM Nanoxerography and Interfacial Seeded Growth

Micro/Nanoscale Structure Fabrication by Direct Nanoimprinting of Metallic and Semiconducting Nanoparticles

Fabrication And Applications Of Ordered Au Nanodisk And Nanohole Arrays

Batch Preparation of Gold Nanoparticles with Highly Uniform Morphology and Tunable Plasmonic Properties

Rapid Fabrication of Au Nanoparticle Films with the Aid of Centrifugal Force.

Direct Writing Nanostructures on Au Nano-Film by Laser Irradiating Cantilevered Scanning Near-Field Optical Microscope Tip

Fabrication of Gold Micro/nanostructures by Femtosecond Laser Direct Writing and Chemical Etching

Single-Nanoparticle-Based Nanomachining for Fabrication of a Uniform Nanochannel Sensor

Fabrication of Ultrafine Nanostructures

Fabrication of sub-50-nm solid-state nanostructures on the basis of dip-pen nanolithography

High Speed Atomic Force Microscope Lithography Driven By Electrostatic Interaction