Abstract:Purpose The purpose of this paper is to develop thermal modelling to investigate the thermal response of sample boards (at board level) during the preheating stage of the reflow process and to validate with experimental measurements. Design/methodology/approach A thermal‐coupling method that adopted the Multi‐physics Code Coupling Interface (MpCCI) was utilized. A forced‐convection reflow oven was modelled using computational fluid dynamic software ( FLUENT 6.3.26 ), whereas structural heating at the board level was conducted using finite‐element method software ( ABAQUS 6.9 ). Findings The simulation showed a complex flow pattern having characteristics of a free‐jet region, stagnation‐flow region, wall jet‐region, recirculation region and vortices. A sharp maximum heat‐transfer coefficient was detected in the stagnation region of the jet, resulting in a spatial variation of local heat transfer on a thermal profile board (TPB). This coefficient affected the temperature distribution in the TPB with different specific heat capacitances and thermal conductivity of the structure. The simulation results were in good agreement with the experimental data and analytical model. The cold region and temperature uniformity (ΔT) increased with increasing complexity of the TPB. The cold region can occur in two possible locations in the TPB. Both occurrences can be related to the flow field of the reflow oven. ΔT of the TPB decreased when the conveyor speed (v) was reduced. A suitable conveyor speed (1.0 cm/s) was determined to maintain ΔT below 10°C, which prevented the thermally critical package from overheating. Practical implications The paper provies a methodology for designing a thermal profile for reflow soldering production. Originality/value The findings provide fundamental guidelines to the thermal‐coupling method at the board and package levels, very useful for accurate control of ΔT at the board and package levels, one of the major requirements in achieving a high degree of reliability for electronic assemblies.

Determination of Smarter Reflow Profile to Achieve a Uniform Temperature Throughout a Board

Determination of Smarter Reflow Profile to Achieve a Uniform Temperature Throughout a Board

Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components

A Reflow Soldering Retro-Design System for Rework Station Based on Q-factor

Temperature Modeling of Reflow Soldering Based on the Heat Transfer Mechanisms

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Thermal profiling: a reflow process based on the heating factor

Temperature prediction for system in package assembly during the reflow soldering process

Controlling And Optimization Of Thermal Profile In Reflow Soldering

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method

A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process

Numerical investigations on the effects of different cooling periods in reflow-soldering process

Optimization simulation of reflow welding based on prediction of regional center temperature field

CFD modelling of the flow field inside a reflow oven

Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model

A Numerical Technique to Evaluate Warpage Behavior of Double Sided Rigid-Flex Board Assemblies during Reflow Soldering Process

Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process