Antisolvent free deposition of lead–tin-based MAPbxSn1−x(I0.75Br0.25)3 perovskite with a wide range of bandgap variation

C. Q. Howlader,W. Geerts,Y. M. Chen
DOI: https://doi.org/10.1557/s43579-024-00569-w
2024-05-24
MRS Communications
Abstract:Lead–tin-based perovskite films have great potential for application in efficient solar cells, including tandem, and underwater solar cells. Continuous pin-hole-free MAPbxSn1−x(I0.75Br0.25)3 (with x value of 0, 0.25, 0.5, 0.75, and 1) were spin-casted on glass substrates without the use of antisolvent from a precursor ink containing methylammonium acetate (MAAc) additive. The bandgap decreases with the increase of tin/lead ratio and is tunable from ~ 1.28 to ~ 1.71 eV. MAPbxSn1−x(I0.75Br0.25)3 films deposited by a one-step spin-casting process using MAAc in the ink have similar properties to films deposited by a two-step spin casting process using MAAc-free ink and an antisolvent step.
materials science, multidisciplinary
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