Effect of thermal activation energy on the structure and conductivity corrosion resistance of Cr doped TiN films on metal bipolar plate

Fangyuan Yan,Bailing Jiang,Ziyu Wang,Jing Shi
DOI: https://doi.org/10.1016/j.matchemphys.2022.126082
IF: 4.778
2022-06-06
Materials Chemistry and Physics
Abstract:Cr doped TiN films were prepared on metal substrates via heating magnetron sputtering at different deposition temperatures (200 °C–350 °C). Vacuum thermal activation energy caused by heating obviously affect the microstructure, hydrophobicity, conductivity and corrosion resistance performance which were systematically investigated. The thickness of the Cr doped TiN films reduced from 573.1 nm to 487.5 nm with the elevating substrate temperature, increasing the films density and hydrophobicity. The maximum water contact Angle is 115.86° and minimum interfacial contact resistance (ICR) is 3.62 mΩ cm 2 at 350 °C of which the electrical conductivity completely satisfy with the DOE target (<10 mΩ cm 2 ), indicating a potential application of Cr doped TiN films on stainless steel (SS) for metal bipolar plate.
materials science, multidisciplinary
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