Abstract:We have investigated the potential of self-assembled monolayer (SAM) coatings for the purpose of adhesion reduction in microelectromechanical systems (MEMS). Two types of SAM coatings, derived from the precursor molecules octadecyltrichlorosilane [CH/sub 3/(CH/sub 2/)/sub 17/SiCl/sub 3/, OTS] and 1H,1H,2H,2H-perfluorodecyltrichlorosilane [CF/sub 3/(CF/sub 2/)/sub 7/(CH/sub 2/)/sub 2/SiCl/sub 3/, FDTS], were applied to polycrystalline silicon microstructures in a liquid-based process. Due to the hydrophobicity of these coatings, the water capillary forces responsible for the phenomenon known as release-related stiction are eliminated, and SAM-coated cantilever beams 2 /spl mu/m thick, 2 /spl mu/m above the substrate, and up to 2 mm in length emerge dry and free standing when removed from the final water rinse. The effects of SAM coating on adhesion encountered during device operation, termed in-use stiction, were characterized using arrays of cantilever beams of varying lengths. Structures made with a polycrystalline silicon of 3-nm rms roughness gave apparent works of adhesion of 30 and 8 /spl mu/J/m/sup 2/ for the OTS and FDTS SAM coatings, respectively, in comparison to 56 mJ/m/sup 2/ for standard oxide-coated structures. These results demonstrate that OTS coating reduces adhesion by more than three orders of magnitude over the conventional process and that the fluorinated SAM can lessen it further by four times. With regard to thermal stability, both SAM coatings can withstand heat treatment for 5 min at 450/spl deg/C in an N/sub 2/ ambient. In air, the OTS film begins to degrade at 150/spl deg/C while the fluorinated coating remains intact up to 400/spl deg/C. Therefore, both types of SAM coatings are compatible with several MEMS packaging techniques, with the FDTS monolayers exhibiting superior stiction and thermal stability properties to those derived from OTS. Furthermore, the FDTS formation does not require any chlorinated solvents such as carbon tetrachloride, which has been banned from industrial use, making the latter coating an industrially viable antistiction treatment.

Effect of Self-Assembled Monolayer (SAM) on the Oxide Semiconductor Thin Film Transistor

Electrochemical Studies on Self-Assembled Monolayer (sam) Upon Exposure to Anionic Surfactants: Pfoa, Pfos, Sds and Sdbs

Effect of Self-Assembled Monolayers (SAMs) as Surface Passivation on the Flexible a-InSnZnO Thin-Film Transistors

Role of Self-Assembled Monolayers on Improved Electrical Stability of Amorphous In-Ga-Zn-O Thin-Film Transistors

Tailored Self-Assembled Monolayer using Chemical Coupling for Indium-Gallium-Zinc Oxide Thin-Film Transistors: Multifunctional Copper Diffusion Barrier

Vapor-Phase Self-Assembled Monolayer With Functional Groups as a Copper Diffusion Barrier Layer for InSnZnO Thin-Film Transistors

Effect of Head Groups in Self-Assembled Monolayer Passivation on Properties of InSnZnO Thin-Film Transistors

The Role of Self‐Assembled Monolayers in the Performance‐Stability Trade‐Off in Organic Solar Cells

Barrier height modulation in Amorphous IGZO/Metal interface using Trichlorosilane-Based Self-Assembled monolayers

Ultrathin Self-Assembled Monolayer for Effective Silicon Solar Cell Passivation

Remote Doping Effects of Indium–Gallium–Zinc Oxide Thin-Film Transistors by Silane-Based Self-Assembled Monolayers

Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines

Solid-State Densification of Spun-Cast Self-Assembled Monolayers for Use in Ultra-Thin Hybrid Dielectrics

Facile post‐treatment of self‐assembled monolayers for efficient inverted perovskite solar cells

Molecular self-assembled monolayers anomalously enhance thermal conductance across polymer-semiconductor interfaces

Monomers effect on the gas and humid barrier properties in PECVD deposited SiOx film on PET surface

Enhanced Electrical Properties of Thin-Film Transistor with Self-Passivated Multistacked Active Layers

Teflon/SiO2 Bilayer Passivation for Improving the Electrical Reliability of Oxide TFTs Fabricated Using a New Two-Photomask Self-Alignment Process

Effects of Semiconductor-Dielectric Interfaces on Polymeric Thin-Film Transistors

Preparation and study of complex self-assembled film as a super-thin barrier on silver

Improved Molecular Packing of Self-Assembled Monolayer Charge Injectors for Perovskite Light-Emitting Diodes