Bonding strength and thermal conductivity of novel nanostructured Lu2Si2O7/Lu2SiO5 environmental barrier coating

Donghui Guo,Baosheng Xu,Xinlei Jia,Runze Jin,Baolu Shi,Zelong Wang,Yiguang Wang
DOI: https://doi.org/10.1016/j.surfcoat.2024.130600
IF: 4.865
2024-03-01
Surface and Coatings Technology
Abstract:As is known to all, environmental barrier coating requires high bonding strength and low thermal conductivity to extend the service life of ceramic matrix composite (CMC) components. In this work, a novel nanostructured Lu2Si2O7/Lu2SiO5 environmental barrier coating was deposited successfully using as-synthetized Lu2Si2O7 feedstocks and Lu2SiO5 feedstocks. Meanwhile, the microstructure, bonding strength and thermal conductivity of Lu2Si2O7/Lu2SiO5 coating were analysed systematically. Results indicate that the nanostructured Lu2Si2O7/Lu2SiO5 environmental barrier coating processes a bi-model microstructure. The Lu2Si2O7/Lu2SiO5 coating is relatively dense and the Lu2Si2O7 layer and Lu2SiO5 layer achieve the mechanical interlocking. The bonding strength of Lu2Si2O7/Lu2SiO5 coating is 14.9 MPa. In addition, the thermal conductivity of Lu2Si2O7/Lu2SiO5 coating is 0.59 W·m−1·K−1–1.24 W·m−1·K−1 from 25 °C to 1200 °C, which is visibly lower than that of Lu2SiO5 coating.
physics, applied,materials science, coatings & films
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