Enhancing Carrier Mobility and Seebeck Coefficient by Modifying Scattering Factor

Lizhong Su,Haonan Shi,Sining Wang,Dongyang Wang,Bingchao Qin,Yuping Wang,Cheng Chang,Li‐Dong Zhao
DOI: https://doi.org/10.1002/aenm.202300312
IF: 27.8
2023-03-24
Advanced Energy Materials
Abstract:The anisotropic charge density in layered materials acts as a subordinate scattering process that participates in electron scattering. The resulting anisotropic scattering factor leads to superior electrical properties along the out‐of‐plane direction compared to in‐plane direction in anion‐doped n‐type SnSe crystals, indicating the potential of modifying r to improve the thermoelectric performance. Thermoelectric materials possess the potential for refrigeration and power generation due to their ability to directly convert heat and electricity. Carrier mobility and the Seebeck coefficient are key properties of thermoelectric materials. Improving the effective mass is the most effective and frequent way to optimize the Seebeck coefficient. However, carrier mobility deteriorates dramatically with increasing effective mass and thus limits further improvement of thermoelectric performance. Here, the focus is on the importance of modifying the scattering factor (r) to enhance the electrical properties, and it is found that the anisotropic scattering factor enhances the carrier mobility and Seebeck coefficient of anion‐doped n‐type tin selenide crystals along the out‐of‐plane direction, indicating the potential of modifying r to improve electrical properties. Following this strategy, the average dimensionless figure of merit (ZTave) for iodine‐doped SnSe crystals is significantly improved from 0.84 to 1.57 in 300–773 K. The results emphasize the critical role of scattering factor and propose a new perspective for enhancing carrier mobility, providing a novel strategy to optimize thermoelectric performance.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,energy & fuels
What problem does this paper attempt to address?