Abstract:Soft wearable cooling devices using flexible thermoelectric coolers (TECs) are highly advantageous for diverse applications. However, challenges remain in low cooling capacity, short device lifetime, and limited understandings of the impact of thermoelectric component's dimension, structure and density on their cooling capacity. Here, we addressed these issues by engineering a large-electrode flexible TEC composed of thermoelectric components embedded in a three-layer polydimethylsiloxane (PDMS) matrix interconnected with biphasic liquid metal traces (core-shell structured liquid metal nanoparticles and nickel-doped GaIn). Attributed to the larger electrodes and three-layer PDMS, the TECs significantly reduce the amount of liquid metal used, minimize the risk of leakage, lower the cost, eliminate environmental pollution, and improve product reliability and manufacturing efficiency. We further optimized the TEC structure design by finite element analysis, providing a generic TEC design kit taking into account multiple physical fields and impact factors. The demonstrated TECs offer high cooling capacity (7.4°C) and great performance stability under deformation, which outperform previously reported models that use similar materials and structures. This work represents a significant step forward in the development of flexible TECs, with promising applications in fields such as wearable devices, electronic skins, and smart textiles.

Recent advances in passive cooling materials for thermal management in flexible electronics

Recent Advances on Thermal Management of Flexible Inorganic Electronics

Recent advances on thermal analysis of stretchable electronics

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Advanced Thermoelectric Materials for Flexible Cooling Application

Recent Advancements in Flexible Humidity Sensors

Progress in Stretchable Fiber-Based Thermoelectric Materials and Devices

Flexible Thermoelectric Devices with Flexible Heatsinks of Phase-Change Materials and Stretchable Interconnectors of Semi-Liquid Metals

Recent Advances in the Material Design for Intelligent Wearable Devices

Long-Lasting Heat Dissipation of Flexible Heat Sinks for Wearable Thermoelectric Devices

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Rise of flexible high-temperature electronics

Recent advances in printed flexible heaters for portable and wearable thermal management

Ultrathin, soft, radiative cooling interfaces for advanced thermal management in skin electronics

Composite Materials: Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics (adv. Funct. Mater. 45/2019)

Flexible Devices: from Materials, Architectures to Applications

Flexible thermoelectric materials and devices: From materials to applications

Liquid metal-based flexible and wearable thermoelectric cooling structure and cooling performance optimization

Advancing flexible thermoelectrics for integrated electronics

Flexible composite phase change materials with enhanced thermal conductivity and mechanical performance for thermal management

Recent Advances in Flexible Temperature Sensors: Materials, Mechanism, Fabrication, and Applications