Sulfur- and Nitrogen- Containing Molybdenum Films with a Thermally Stable Precursor

Andrea Leoncini,Chandan Kr Barik,Feng Q Liu,Jiecong Tang,John Sudijono,Mark Saly
DOI: https://doi.org/10.1149/ma2023-02291456mtgabs
2023-12-22
ECS Meeting Abstracts
Abstract:As devices become more and more complex with each generation, process requirements become more stringent and new materials are necessary. This also translates to the need of new precursors, in particular halide free organometallic precursors with high thermal stability. This combination prevents halide contamination/corrosion of the deposited and neighboring films, and expands the ALD window for processes. However, higher thermal stability should not compromise the reactivity of the precursors in the desired processes. We designed and successfully synthesized a new halide-free Mo precursor. It was characterized by 1 H-, and 13 C- NMR spectroscopy, and its molecular structure have been confirmed by x-ray crystallography. We studied its thermal stability, volatility, and chemical properties. Thermogravimetric analysis shows good volatility, with T 1⁄2 of 230 o C and residual mass below 1%. Isothermal TGA at 130 °C indicates that the chemical is volatile and deliverable to the reaction chamber. Its thermal stress analysis showed that it is stable at 200 o C for more than 1 day, with ~1% residue mass. Pyrolysis experiments showed little decomposition at 475 °C. We used this precursor to attempt to deposit MoO, MoN and MoS based materials in mild conditions. ALD with NH 3 afforded non uniform films with C contamination, and very low gpc. Similar results were obtained with H 2 O. On the other hand, films deposited with H 2 S were of uniform thickness with good gpc and selectivity for W over Si. The S content on the Mo-rich films was dependent on the deposition conditions and values as low as 6% could be obtained. Figure 1
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