Texture-structure-based liquid metal filling for blind-end microchannels and its application on multi-layer chips

Yuqing Li,Huimin Zhang,Qian Li,Yuqin Deng,Zi Ye,Lin Gui

DOI: https://doi.org/10.1039/d3ra04497a

IF: 4.036

2023-01-01

RSC Advances

Abstract:Multi-layer liquid metal high-precision filling with only one injection inlet.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Capillary-Based Microfluidic Fabrication of Liquid Metal Microspheres Toward Functional Microelectrodes and Photothermal Medium.

Pengcheng Lin,Zhan Wei,Qi Yan,Jiajin Xie,Yufeng Fan,Minghui Wu,Ying Chen,Zhengdong Cheng

DOI: https://doi.org/10.1021/acsami.9b03007

IF: 9.5

2019-01-01

ACS Applied Materials & Interfaces

Abstract:Liquid metals (LMs) possess tremendous potential applications in flexible electronic devices, heat flow management, and smart actuators. Splitting the bulk LMs into microspheres is of great significance to fabricate free-standing and microscale LM-based functional materials and devices. However, it is difficult to disperse the bulk LMs into microspheres because of their large surface tension and high density. In this work, the capillary-based microfluidic chip is employed to continuously and automatically generate LM microspheres in a large scale. The capillary-based microfluidic fabrication is universally applicable in ionic aqueous solution, hydrophobic solution, and the polymeric aqueous solution. The precise size control of LM microspheres can be easily realized by the co-flowing configuration in the microchannels. The coefficient of size variation of monodispersed LM microspheres can be controlled to as low as 0.47%. The free-standing LM microspheres can be used as functional microelectrodes within a wide temperature range from -19.8 to 20 °C and to fabricate tunable integrated circuits with different output powers. Most importantly, the LM microspheres exhibit photothermal property, which is used to make the optical sensor with linear response and to conduct the solar energy harvesting. The capillary-based microfluidic fabrication of LM microspheres provides a facile and templated methodology for processing bulk LMs into microscale units. The LM microspheres with excellent electrical conductivity and photothermal property hold great promise for the development of miniature soft electronics, light-driven actuators, and energy conversion medium.
Porous Membrane‐Enabled Fast Liquid Metal Patterning in Thin Blind‐Ended Microchannels

Ronghang Wang,Lin Gui,Lunjia Zhang,Zhizhu He,Meng Gao,Sen Chen,Xuyan Zhou,Yuntao Cui,Zhongshan Deng

DOI: https://doi.org/10.1002/admt.201900256

IF: 6.8

2019-07-05

Advanced Materials Technologies

Abstract:<p>A porous membrane‐enabled fast liquid metal patterning method in thin blind‐ended microchannels is reported. The principle is to introduce a thin porous membrane in polydimethylsiloxane (PDMS) chips, effectively releasing the air pressure of the inner microchannel during the injection process. Traditional direct injection method requires microchannels with both an inlet and an outlet, making blind‐ended microchannel filling impossible. The vacuum filling requires adequate chip thickness and stiffness for the channel to recover after filling. Additionally, high injection pressure may cause leakages and damage to the microchannels. Experiment results indicate that this novel method promotes the injection in thin blind‐ended microchannels without voids and damages. The finest channel that can be filled successfully using this mechanism is with around 12 µm width and 20 µm height. Series of tensile texts for comb capacitor demonstrate that the electrodes have marvelous flexibility. Overall, the capability of filling the mazy blind‐ended channels entirely quickly makes it promising in the fast fabrication of ultrathin stretchable electronics.</p>

materials science, multidisciplinary
Fabrication of full glass chips with hybrid micro- and nanochannels and their application to protein concentration

Qiaohong He,Hua Lu,Shuang Chen,Hengwu Chen

DOI: https://doi.org/10.1109/NANOMED.2009.5559123

2009-01-01

Abstract:In this paper, we proposed an alternative method that is simple and cost-effective to fabricate full glass chips with hybrid micro- and nanochannels. Double-lithography and double wet-etching technique was used for the fabrication of hybrid micro and nanostructures. The microchannels were firstly constructed on a glass substrate by standard UV photolithography and wet etching technique. After washing away the rest photoresist and spinning a new layer of photoresist on the microchannel-structured glass substrate, nanochannels with the depth less than 100 nm were produced on the same substrate by second lithography and wet etching. Then the channels-structured glass substrate was sealed to a cover glass plate by using previously developed room temperature bonding technique. Without using clean room facilities and expensive instruments, micro- and nanofluidic chips with delicate structures were well fabricated. The good nature of those nanofluidic chips was demonstrated by the successful concentration of FITC-labeled bovine serum albumin via electrokinetic ion trapping.
Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits

Mingkuan Zhang,Jiahao Gong,Hao Chang,Xinlong Sun,Pan Zhang,Junheng Fu,Li Liu,Xiaoying Li,Yushu Wang,Wei Rao

DOI: https://doi.org/10.1002/adfm.202215050

IF: 19

2023-03-19

Advanced Functional Materials

Abstract:Inspired by the water transport in plants, a wetting‐induced assembly method based on the differential capillary effect for liquid metal ink (D‐LMWA) is proposed, achieving high‐precision monolayer circuits (4 μm) and multilayer circuits (5 μm), to overcome the difficulties of breakpoints and surface residues. And the transparent shielding conductor with high stretchability and the multilayer touch sensor are achieved. Manipulating liquid metal inks to create conductive microstructures has attracted widespread interest as liquid metal microstructures are turning into influential components in flexible electronics. However, it is challenging to prevent the issues with low precision, low efficiency, and residue caused by sedimentation, free diffusion, and the Marangoni effect. Inspired by the water transport in plants, the wetting‐induced assembly method based on the differential capillary effect for liquid metal ink is created to realize the facile and rapid manufacture of liquid metal conductive microstructures. The single‐micron accuracy circuits with a minimum of ≈4 μm straight lines are fabricated to a centimeter scale. This method can also be extended to the preparation of multilayer circuits (minimum 5 μm through hole). The resulting entirely flexible stretchable circuits make it possible to construct highly stretchable devices, such as flexible transparent conductors and stretching sensors. Transparent conductors exhibit excellent mechanical (maximum ≈750% tensile rupture limit) and optoelectronic properties (the transmittance reaches ≈87% and the sheet resistance is ≈0.5 Ω/□)|making them suitable for optically‐clear electromagnetic shielding. This study offers a fresh and plain approach to solving the assembly problem of liquid metal inks, paving the way for the creation of flexible electronic devices

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Construction of liquid metal-based soft microfluidic sensors via soft lithography

Yang Zhang,Haowei Duan,Guoqiang Li,Maoyu Peng,Xing Ma,Ming Li,Sheng Yan

DOI: https://doi.org/10.1186/s12951-022-01471-0

IF: 10.2

2022-05-29

Journal of Nanobiotechnology

Abstract:Liquid metal (LM) can be integrated into microfluidic channel, bringing new functionalities of microfluidics and opening a new window for soft microfluidic electronics, due to the superior advantages of the conductivity and deformability of LMs. However, patterning the LMs into microfluidic channels requires either selective surface wetting or complex fabrication process.

biotechnology & applied microbiology,nanoscience & nanotechnology
Fabrication of Micro/Nanofluidic Chip on Glass Substrate and Its Application for Electrokinetic Concentration of Proteins

DONG Yuan-Yuan,HU Xian-Qiao,CHEN Shuang,LU Hua,HE Qiao-Hong,CHEN Heng-Wu

DOI: https://doi.org/10.3969/j.issn.0251-0790.2012.05.012

2012-01-01

Abstract:A simple and cost-effective double-lithography and double wet-etching method (abbriciated as double-etching technique) was developed for fabricating the full glass chips with hybrid micro- and nanochannels. The microchannels were firstly constructed on a glass substrate by standard UV photolithography and wet etching technique. After washing away the rest photoresist and spin coating of a new layer of photoresist on the microchannel-structured glass substrate, nanochannels with a depth less than 100 nm were prepared on the same substrate by second lithography and wet etching. Finally, the channel-structured glass substrate was sealed to a cover glass plate using room temperature bonding technique. Without clean room facilities and expensive facilities, fluidic chips with hybrid micro- and nanochannel network were fabricated with high yields. The analytical features of those fluidic chips were demonstrated by the successful concentration of fluorescein isothiocyanate(FITC)-labeled human serum albumin(HSA) via electrokinetic ion trapping. Enrichment factor of more than 200 was achieved for 0.5 mg/mL of FITC-HSA solutions within 30 s.
Injection Molding of Liquid Metal by Harnessing Nonstick Molds

Jinwoo Ma,Dhwanil P. Vaghani,Sooik Im,Minsik Kong,Mohammad Shamsi,Shuzhen Wei,Man Hou Vong,Michael D. Dickey

DOI: https://doi.org/10.1021/acsami.3c16692

IF: 9.5

2024-02-21

ACS Applied Materials & Interfaces

Abstract:The fluid nature of liquid metals combined with their ability to form a solid native oxide skin enables them to be patterned in ways that would be challenging for solid metals. The present work shows a unique way of patterning liquid metals by injecting liquid metals into a mold. The mold contains a nonstick coating that enables the removal of the mold, thereby leaving just the liquid metal on the target substrate. This approach offers the simplicity and structural control of molding but without...

materials science, multidisciplinary,nanoscience & nanotechnology
Metal Microstructure Microfabrication Technique

WU Ying,ZHOU Zhao-ying,XIANG Yi

DOI: https://doi.org/10.3969/j.issn.1002-1841.2006.01.004

2006-01-01

Abstract:The fabrication technique of three-dimensional microstructure is important in the MEMS microfabrication technology.The main methods of are silicon three-dimensional microfabrcaiton combining the SU-8 photoresist and IC process and LIGA-type microfabrcation.However,SU-8 microfabrciaon has limitation on the strip off process and the cost of LIGA-type is high.So,a new three-dimensional microfabrication technique for metal materials was developed from the silicon deep etching technique and electroplating technique.In the present research,a silicon mold with high aspect ratio microstructures was manufactured and metal micro structures were fabricated using this mold.A successful development of this technique opens a alternative way for three dimensional microfabrication techniques.
Microchannels Formed Using Metal Microdroplets

Daicong Zhang,Chunhui Jing,Wei Guo,Yuan Xiao,Jun Luo,Lehua Qi

DOI: https://doi.org/10.3390/mi14101922

IF: 3.4

2023-10-11

Micromachines

Abstract:The metal microdroplet deposition manufacturing technique has gained extensive attention due to its potential applications in microstructure fabrication. In order to fabricate components such as microchannel heat sinks and microchannel reactors, this paper investigates the interactions and influences between microdroplets and substrates, as well as between microdroplets themselves. The transient phenomena during the fusion of metal microdroplets in contact with the substrate and the formation of inclined columns, as well as the solid–liquid coupling and morphology formation processes during the collision between microdroplets, are analyzed. The influence of microdroplet spacing on the morphology of microchannels during their formation is specifically studied. A three-dimensional finite element numerical model for the deposition of metal microdroplets forming inclined pillars is established based on the volume of fluid (VOF) method. The model treats the protective gas around the microdroplet as an empty zone and the microdroplet as a single-phase fluid. Simulation analysis is conducted to investigate the forming patterns of unsupported microdroplets at different spacing and their impact on the fusion morphology of microchannel components. Building upon this, a series of validation experiments are conducted using a piezoelectric microdroplet generator to produce uniform aluminum alloy microdroplets with a diameter of approximately 600 μm. A method for fabricating metal microchannel structures is obtained, which is expected to be applied in fields such as scattering structures for high-power electronic devices and microreactors in microchemical fields.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Pressure Driven Rapid Reconfigurable Liquid Metal Patterning

Bingxin Liu,Peng Qin,Mingyang Liu,Wei Liu,Pan Zhang,Zi Ye,Zhongshan Deng,Zhenming Li,Lin Gui

DOI: https://doi.org/10.3390/mi14040717

IF: 3.4

2023-03-24

Micromachines

Abstract:This paper proposes a method for pressure driven rapid reconfigurable liquid metal patterning. A sandwich structure of "pattern—film—cavity" is designed to complete this function. Both sides of the highly elastic polymer film are bonded with two PDMS slabs. One PDMS slab has microchannels patterned on the surface. The other PDMS slab has a large cavity on its surface for liquid metal storage. These two PDMS slabs are bonded together, face to face, with the polymer film in the middle. In order to control the distribution of the liquid metal in the microfluidic chip, the elastic film will deform under the high pressure of the working medium in the microchannels and then extrude the liquid metal into different patterns in the cavity. This paper studies the factors of liquid metal patterning in detail, including external control conditions, such as the type and pressure of the working medium and the critical dimensions of the chip structure. Moreover, both a single-pattern and a double-pattern chip are fabricated in this paper, which can form or reconfigure the liquid metal pattern within 800 ms. Based on the above methods, reconfigurable antennas of two frequencies are designed and fabricated. Meanwhile, their performance is simulated and tested by simulation and vector network tests. The operating frequencies of the two antennas are respectively significantly switching between 4.66 GHz and 9.97 GHz.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Intermetallic wetting enabled high resolution liquid metal patterning for 3D and flexible electronics

Lucy Johnston,Jiong Yang,Jialuo Han,Kourosh Kalantar-Zadeh,Jianbo Tang

DOI: https://doi.org/10.1039/d1tc04877e

IF: 6.4

2022-01-01

Journal of Materials Chemistry C

Abstract:The intermetallic wetting between metallic liquids and solid surfaces enables a high-resolution liquid metal patterning strategy which is widely applicable for fabricating functional patterns on versatile substrates and planar/3D geometries.

materials science, multidisciplinary,physics, applied
Flexible Microcircuit of a Liquid Metal Deposit Layer

Jiaye Zhan,Qijia Wang,Yiming Zhao,Fei Zhan,Shousheng Tang,Qian Wang,Jing Liu,Lei Wang

DOI: https://doi.org/10.1002/cnma.202300227

IF: 3.82

2023-01-01

ChemNanoMat

Abstract:Liquid metal (LM) is of great use in many fields (e. g., sensors, biology, electronic circuits). With special mobility, high surface tension and excellent electrical conductivity, it can play a role in the field of flexible electronics. Due to its surface tension, it easily shrinks into a spheroid shape. Especially under the same current condition, the shrinkage of the volume will lead to open circuit, so it is very difficult to produce stable liquid metal ultrathin, ultrafine wire, which has become a barrier limiting the use of liquid metal. In this work, LM is mixed with polydimethylsiloxane to form a micrometer-thick conductive layer by free deposition. The LM is located inside the polymer holes. Not only that, microcircuits are also mapped on the surface of LM deposits. It not only has excellent electrical conductivity, but also has good flexibility. This work explores a simple method to produce a ultrathin conductive film and reduce the size of electronic components, which has potential applications in integrated circuits.
Ultra-conformable liquid metal particle monolayer on air/water interface for substrate-free E-tattoo

Fali Li,Wenjuan Lei,Yuwei Wang,Xingjian Lu,Shengbin Li,Feng Xu,Zidong He,Jinyun Liu,Huali Yang,Yuanzhao Wu,Jie Shang,Yiwei Liu,Run-Wei Li

DOI: https://doi.org/10.1038/s41528-023-00263-2

IF: 14.6

2023-07-12

npj Flexible Electronics

Abstract:Gallium-based liquid metal has gained significant attention in conformal flexible electronics due to its high electrical conductivity, intrinsic deformability, and biocompatibility. However, the fabrication of large-area and highly uniform conformal liquid metal films remains challenging. Interfacial self-assembly has emerged as a promising method, but traditional approaches face difficulties in assembling liquid metal particles. Here, we realized the multi-size universal self-assembly (MUS) for liquid metal particles with various diameters ( 100 cm 2 ) and high floating yield (50–90%). Moreover, the films can be conformally transferred onto complex surfaces such as human skin, allowing for the fabrication of substrate-free flexible devices. This eliminates interference from traditional substrate mechanical responses, making the liquid metal e-tattoo more user-friendly.

materials science, multidisciplinary,engineering, electrical & electronic
Design and manufacture of high-filling-efficiency microfluidic devices

Chun-Te Wu,Gou-Jen Wang

DOI: https://doi.org/10.1007/s00170-018-2039-1

IF: 3.563

2018-05-01

The International Journal of Advanced Manufacturing Technology

Abstract:In this study, we proposed an efficient method for mass production of high-filling-efficiency microfluidic devices. Precision machining was the main process of device fabrication. The commercially available SolidWorks software was adopted for structure design. Unigraphics software was then used to simulate the machining process. The simulated tooling file was then loaded into a CNC milling machine for mold production. The fabricated metal mold was used for pouring polydimethylsiloxane (PDMS) to obtain high-filling-efficiency microfluidic structures. Finally, plasma-assisted packaging was conducted to tightly bind the PDMS microfluidic structure to the glass substrate. Experimental results showed that the additional semicircular filling structure and expended fill-entry structure can efficiently enhance filling efficiency of the microchannel device. The incubation well array can be completely filled at a relatively short filling time. The proposed highly efficient filling microfluidic device possesses advantages, such as feasibility for mass production and cost effectiveness.

engineering, manufacturing,automation & control systems
3D‐Printed Multi‐scale Fluidics for Liquid Metals

Gabriel L. Smith,Ava S. Gesell,Michael Restaino,Joshua B. Tyler,Xin Xu,Ryan D. Sochol,Sarah Bergbreiter,Nathan Lazarus

DOI: https://doi.org/10.1002/admt.202301980

IF: 6.8

2023-12-23

Advanced Materials Technologies

Abstract:A multi‐scale 3D printing approach based on Direct Laser Writing (DLW) on the surface of a stereolithography printed part is presented for patterning micrometer and mm‐scale liquid metal features in the same 3D printed part. The resulting process is demonstrated for creating microscale coils with larger inlet channels for liquid metal inductors. Room‐temperature eutectic Gallium Indium (eGaIn)‐based devices offer stretchable, conductive, and reconfigurable properties for robotics, communications, and medicine. Microfluidics enables eGaIn device creation, but these typically have larger feature sizes. Recent three‐dimensional (3D) printing advancements, particularly direct laser writing (DLW), allow for sub‐100 μm microfluidic devices. However, interfacing DLW microfluidics with larger systems poses challenges in channel resist removal, eGaIn filling, and electrical integration, limiting micro‐scale liquid metal device application. This study introduces a multiscale, cost‐effective, three‐step process combining DLW‐fluidic microchannels with centimeter‐scale substrates made via stereolithography (SLA). It establishes a robust interface between independently printed materials and simplifies eGaIn filling in microfluidic channels as small as 50 μm, potentially enabling smaller liquid metal features. The research also presents eGaIn coils with 43–770 mΩ resistance and 2–4 nH inductance. This process facilitates low‐temperature, conductive, flexible interfaces for sensors, actuators, and circuits, and expands the range for size‐dependent properties of passive electronic components like resistors, capacitors, and inductors from liquid metal.

materials science, multidisciplinary
Fabrication of Microfluidic Chips Using Laser Click Deposition

Mengqi Lv,Xinyu He,Kai Zhou,Ben Niu,Wei,Haoran Li,Shasha Liu,Hua Su,Wei Wang

DOI: https://doi.org/10.1039/d2sd00060a

2022-01-01

Sensors & Diagnostics

Abstract:A programmable and low-cost laser click deposition method is proposed to form complicated patterns as master molds for microfluidic chips.
Flexible microcircuit of liquid metal deposit layer

Jiaye Zhan,Qijia Wang,Yiming Zhao,Fei Zhan,Shousheng Tang,Qian Wang,jing liu,Lei Wang

DOI: https://doi.org/10.1002/cnma.202300227

IF: 3.82

2023-07-23

ChemNanoMat

Abstract:Liquid metal (LM) is of great use in many fields. For example, sensors, biology, electronic circuits and so on. With special mobility, high surface tension and excellent electrical conductivity, they can play a role in the field of flexible electronics. Due to its surface tension, it easily shrinks into a spheroid shape. Especially under the same current condition, the shrinkage of the volume will lead to open circuit, so it is very difficult to produce stable liquid metal ultra‐thin, ultra‐fine wire, which has become a barrier limiting the use of liquid metal. In this work, LM is mixed with Polydimethylsiloxane to form micro‐thick conductive layer by free deposition. The LM is located inside the polymer holes. Not only that, microcircuits are also mapped on the surface of LM deposits. It not only has excellent electrical conductivity, but also has good flexibility. This work explores a simple method to produce ultra‐thin conductive film and reduce the size of electronic components, which has potential applications in integrated circuit.

materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
Glass‐Channel Molding Assisted 3D Printing of Metallic Microstructures Enabled by Femtosecond Laser Internal Processing and Microfluidic Electroless Plating

Jian Xu,Xiaolong Li,Yi Zhong,Jia Qi,Zhenhua Wang,Zhifang Chai,Wenwu Li,Chengbin Jing,Ya Cheng

DOI: https://doi.org/10.1002/admt.201800372

IF: 6.8

2018-09-27

Advanced Materials Technologies

Abstract:3D printing of metallic microstructures is highly desirable for many practical applications such as microelectronics, terahertz photonics, microelectromechanical systems, and electrochemisty. Unfortunately, high resolution microprinting of 3D metal structures with widely tunable feature sizes, high conductivities, high melting points, and highly smooth surfaces remains challenging for current microfabrication technologies. Herein, 3D printing of metallic microstructures of feature sizes ranging from ≈10 to ≈200 μm by combining femtosecond laser micromachining of 3D glass microchannels and microfluidic electroless plating is demonstrated. The proposed technique allows for producing 3D metallic structures of almost arbitrary geometries embedded in glass since the continuous flow of the plating solution enables controllable deposition of metal films inside the through microchannels. Moreover, freestanding metallic 3D microstructures are fabricated by removing the glass matrix with a wet chemical etching. As a nonthermal processing, the surface roughness of the fabricated metallic structures is as low as ≈20 nm. The 3D microstructures can be made of either silver or copper covered with a thin layer of silver, which are shown to have a high conductivity. As a proof‐of‐concept demonstration, a 3D metal scaffold structure with a size of ≈5 × 5 × 2 mm3 is printed. Glass‐channel molding assisted 3D printing of free‐standing metal microstructures is demonstrated using femtosecond laser internal processing and microfluidic electroless plating. Using this approach, 3D metal microstructures with widely tunable feature sizes (10–200 µm), flexible configurations, high conductivity, and high surface smoothness can be printed.

materials science, multidisciplinary
Fabrication of fillable microparticles and other complex 3D microstructures

Kevin J McHugh,Thanh D Nguyen,Allison R Linehan,David Yang,Adam M Behrens,Sviatlana Rose,Zachary L Tochka,Stephany Y Tzeng,James J Norman,Aaron C Anselmo,Xian Xu,Stephanie Tomasic,Matthew A Taylor,Jennifer Lu,Rohiverth Guarecuco,Robert Langer,Ana Jaklenec,Kevin J. McHugh,Thanh D. Nguyen,Allison R. Linehan,Adam M. Behrens,Zachary L. Tochka,Stephany Y. Tzeng,James J. Norman,Aaron C. Anselmo,Matthew A. Taylor

DOI: https://doi.org/10.1126/science.aaf7447

IF: 56.9

2017-09-15

Science

Abstract:Technology used for computer chip manufacturing is combined with soft lithography to produce small polymeric structures.

multidisciplinary sciences
Liquid Metal Based Mini/Micro Channel Cooling Device

Yue-Guang Deng,Jing Liu,Yi-Xin Zhou

DOI: https://doi.org/10.1115/icnmm2009-82046

2009-01-01

Abstract:Effective heat dissipation is of great importance in many engineering fields. In this paper, we investigated a newly emerging method to significantly improve the cooling capability of micro channel devices, through implementing liquid metal with low melting point as the powerful coolant. A series of experiments with different working fluids and volume flow were performed, and the different cooling effects between liquid metal and water were compared. In order to better evaluate the cooling capability of liquid metal based micro channel cooling device, the hydrodynamic and heat transfer theory involved was discussed. The results indicated that, when the system operated in a relatively high velocity, micro channel cooling devices with liquid metal as coolant could produce higher convective heat transfer coefficient compared to those with traditional cooling fluids. And under the same pump power, not only the thermal resistance of liquid metal based micro channel could be much smaller, but also the coolant volume flow could be decreased. What is more, the liquid metal can be driven by a highly efficient electromagnetic pump without any noise. Therefore, more compact and energy-saving micro channel cooling devices with better cooling capability may come into reality. This new method is rather practical, and is expected to be important for realizing an extremely high heat dissipation rate.

Texture-structure-based liquid metal filling for blind-end microchannels and its application on multi-layer chips

Capillary-Based Microfluidic Fabrication of Liquid Metal Microspheres Toward Functional Microelectrodes and Photothermal Medium.

Porous Membrane‐Enabled Fast Liquid Metal Patterning in Thin Blind‐Ended Microchannels

Fabrication of full glass chips with hybrid micro- and nanochannels and their application to protein concentration

Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits

Construction of liquid metal-based soft microfluidic sensors via soft lithography

Fabrication of Micro/Nanofluidic Chip on Glass Substrate and Its Application for Electrokinetic Concentration of Proteins

Injection Molding of Liquid Metal by Harnessing Nonstick Molds

Metal Microstructure Microfabrication Technique

Microchannels Formed Using Metal Microdroplets

Pressure Driven Rapid Reconfigurable Liquid Metal Patterning

Intermetallic wetting enabled high resolution liquid metal patterning for 3D and flexible electronics

Flexible Microcircuit of a Liquid Metal Deposit Layer

Ultra-conformable liquid metal particle monolayer on air/water interface for substrate-free E-tattoo

Design and manufacture of high-filling-efficiency microfluidic devices

3D‐Printed Multi‐scale Fluidics for Liquid Metals

Fabrication of Microfluidic Chips Using Laser Click Deposition

Flexible microcircuit of liquid metal deposit layer

Glass‐Channel Molding Assisted 3D Printing of Metallic Microstructures Enabled by Femtosecond Laser Internal Processing and Microfluidic Electroless Plating

Fabrication of fillable microparticles and other complex 3D microstructures

Liquid Metal Based Mini/Micro Channel Cooling Device