Abstract:Cold electronics is a key technology in many areas of science and technology including space exploration programs and particle physics. A major experiment with a very large number of analog and digital electronics signal processing channels to be operated at cryogenic temperatures is the next-generation neutrino experiment, the Deep Underground Neutrino Experiment (DUNE). The DUNE detector uses liquid Argon at 87K as a target material for neutrinos, and as a medium to track charged particles resulting from interactions in the detector volume. The DUNE electronics [1] consists of custom-designed ASIC (Application Specific Integrated Circuits) chips based on low power 180 nm-CMOS technology. The main risk for this technology is that the electronics components will be immersed in liquid argon for many years (20-30 years) without access. Reliability issues of ASICs may arise from thermal stress, packaging, and manufacturing-related defects: if undetected those could lead to long-term reliability and performance problems. The scope of this paper is to explore non-destructive evaluation techniques for their potential use in a comprehensive quality control process during prototyping, testing and commissioning of the DUNE cold electronics system. Specifically, we have used the Scanning Acoustic Microscopy and X-ray tomography to study permanent structural changes in the ASIC chips associated with thermal cycling between the room and cryogenic temperatures.

Thermalization of a SQUID Chip at Cryogenic Temperature: Thermal Conductance Measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement Between 20 and 200 mK

Thermalization of a SQUID chip at cryogenic temperature: Thermal conductance measurement for GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement between 20 and 200 mK

Measuring the Refractive Index of Optical Adhesives at Cryogenic Temperatures.

Cryogen-free variable temperature scanning SQUID microscope

Reliability studies of electronic components for the operation at cryogenic temperature

Scanning SQUID microscopy in a cryogen-free cooler

Monte Carlo Comparisons to a Cryogenic Dark Matter Search Detector with low Transition-Edge-Sensor Transition Temperature

Thermal resistance in superconducting flip-chip assemblies

The Cryogenic AntiCoincidence detector for ATHENA X-IFU: improvement of the test setup towards the Demonstration Model

Scanning SQUID microscopy in a cryogen-free dilution refrigerator

Thermal Conductivity Measurement of the Epoxies and Composite Material for Low Temperature Superconducting Magnet Design

The TES-based Cryogenic AntiCoincidence Detector (CryoAC) of ATHENA X-IFU: a large area silicon microcalorimeter for background particles detection

Efficient system for bulk characterization of cryogenic CMOS components

CMOS on-chip thermometry at deep cryogenic temperatures

Method for Efficient Large-Scale Cryogenic Characterization of CMOS Technologies

Variable Temperature Thermal Conductivity and Conductance Measurements Using a Gifford-McMahon Cryocooler

Characterization of the performances of plastic commercial scintillators in cryogenic environments

Temperature Measurement on Copper Surfaces for Superconducting Thin Film Cavity Applications

Thermal coupling of silicon oscillators in cryogen-free dilution refrigerators