Shock mitigation and failure mechanism of copper foam/paraffin phase change reinforced composites

Jingjing Song,Yuliang Lin,Minzu Liang,Wen Liang,Jiakai Guo,Yuwu Zhang
DOI: https://doi.org/10.1016/j.tws.2024.112673
IF: 5.881
2024-11-05
Thin-Walled Structures
Abstract:Copper foam/paraffin phase change reinforced composites (CPPC) were fabricated using vacuum immersion technology to address the pressing need for phase change reinforced composite applications. Experiments were conducted to explore the influence of strain rate and relative density of the matrix material on the mechanical properties of the CPPC under both quasi-static and dynamic conditions. A 3D-Voronoi model of the CPPC was developed with randomly varying relative density, based on real porous metal foam and utilizing graphical parametric design tools. The mechanical behavior of the CPPC under impact loading was studied, focusing on deformation, energy absorption, and damage mechanisms. Comparison and analysis of stress-strain curves and deformation modes were performed using experimental and modeling data. The shear failure modes of CPPC under quasi-static compression include 'X-shaped fracture,' 'blocky spalling,' or '45° parallel fracture,' depending on the relative density of the copper foam matrix. The addition of paraffin effectively improved the energy-absorbing properties of copper foam. As the relative density of the copper foam matrix increased, the enhancement in energy absorption became more pronounced, while the improvement in modulus and yield strength decreased. The composite exhibited an 83% increase in specific energy absorption compared to copper foam alone, with the paraffin filler absorbing 69% of the total energy during impact loading. The CPPC acted as a mechanical filter through stress wave reflection and transmission attenuation. The investigation into the shock mitigation and failure mechanisms of CPPC could offer valuable insights for the design of functional composites. Furthermore, it could inspire the creation of impact-resistant and heat dissipation structures for electronic devices.
engineering, mechanical,mechanics, civil
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