Design and Modulation of Negative Thermal Expansion for Epoxy Polymers

Jiajun Li,Zaiping Zou,Yingsheng Lai,Yeping Wu,Mao Chen,Xiuli Zhao,Zhongtao Chen
DOI: https://doi.org/10.1021/acsmacrolett.4c00578
IF: 5.8
2024-10-25
ACS Macro Letters
Abstract:Modulating the coefficient of thermal expansion (CTE) and realizing low or negative thermal expansion (NTE) for epoxy polymers are challenging issues. In this study, we developed an effective strategy to prepare epoxy polymers with an NTE performance. A novel motif DBCOD-NH(2) based on the dibenzocyclooctadiene (DBCOD) was designed, synthesized, and utilized as a curing agent for several commercial epoxy resins. DBCOD-NH(2) suppressed the thermal expansion of the epoxy polymer due to the...
polymer science
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