High Temperature Cofired Ceramic (HTCC), Low Temperature Cofired Ceramic (LTCC), and Ultralow Temperature Cofired Ceramic (ULTCC) Materials

M.T. Sebastian,Heli Jantunen
DOI: https://doi.org/10.1002/9781119208549.ch8
2017-03-25
Abstract:The rapid development in the microelectronic industry has created a high demand for low loss microwave ceramics due to their reliability, high integration potential, and good dielectric properties. Multilayer ceramic technology can be divided into three parts: high temperature cofired ceramics (HTCC) (sintering temperature <950 ºC), low TCC (LTCC) (sintering temperature 700‐950 ºC), and ultralow TCC (ULTCC) can be produced by water‐based techniques. Water‐based tape casting is more environment friendly, inexpensive, and limits the CO2 emissions as compared to the organic solvent‐based tape casting. For an effective tape casting, well‐dispersed and stable ceramic slurry is essential. The microwave dielectric properties of ceramics with glass additives strongly depend on the densification, microstructure, and interactions between glass and ceramics.
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