Abstract:Cylindrical grinding of advanced ceramic materials, like silicon nitride, is a crucial machining process for high-precision industrial applications. The goal is to achieve a damage-free surface and subsurface while ensuring high grinding efficiency and desirable material removal rates. For the first time in the cylindrical grinding process, a laser structuring of the Si 3 N 4 workpiece has been employed to structure the material surface before the grinding process. The structuring process is conducted as a time-independent process. The laser structuring aims to generate a controllable damaged zone, which reduces grinding forces and temperature. This reduction subsequently leads to an increase in the achievable material removal rate. A series of line structures parallel to the workpiece axis with different structure percentages has been generated on the circumferential surface of the samples using a nanosecond laser. The influence of laser structuring on thermal damage zones has been microstructurally investigated through SEM and EDS analyses. The thermal damages caused by the laser before the grinding process (exhibiting different microstructures and chemical compositions) are categorized as the recast layer and the heat-affected zone (HAZ). The maximum damage thickness for the recast layer is 2 μm, whereas the thickness of the heat-affected zone is approximately 10 μm. The HAZ thickness could increase up to 50 μm if the snowflakes are placed in close proximity to the thermal damage zone. The study also explored the tangential grinding force and the surface integrity, including characteristics like surface roughness and microstructure of the ground surface in laser-assisted cylindrical grinding. The results indicate that laser structuring substantially reduces the tangential grinding force (up to 75 %). Moreover, the proposed laser-assisted grinding process could achieve a damage-free subsurface and even slightly better ground surface quality compared to the conventional grinding process. This study introduces a novel approach by predicting the grinding allowance through material analysis, aiming for a damage-free surface and subsurface.

Investigation of laser-assisted cylindrical grinding of silicon nitride ceramics with controlled damage zone

Experimental investigation on grinding-induced surface damage of Fiber Reinforced Ceramic Matrix Composites

Studies on the Surface Quality of the Unsteady-State Grinding Technique

Laser-assisted surface grinding of innovative superhard SiC-bonded diamond (DSiC) materials

Defect-free grinding of silicon nitride at high material removal rate

Aluminium Nitride Surface Characterization by Grinding with Laser-Ultrasonic Coupling

Laser-assisted grinding of RB-SiC composites: Laser ablation behavior and mechanism

Significant improvement of machinability of C f /SiC composites through matching laser scanning spacing and abrasive belt grain size

A novel low-damage and low-abrasive wear processing method of Cf/SiC ceramic matrix composites: Laser-induced ablation-assisted grinding

Experimental investigation on the feasibility of high-efficiency and precision grinding of silicon carbide ceramics with monolayer brazed diamond wheel

A new method for machining RB-SiC with high efficiency and quality: Laser assisted ultrasonic grinding

Subsurface damage inhibiting and synchronous removal behavior of C f /SiC composites with laser-induced controllable ablation during abrasive belt grinding

Ablation and surface structuring of Si3N4 ceramics by nanosecond laser pulses

Parallel Grooved Microstructure Manufacturing on the Surface of Si3N4 Ceramics by Femtosecond Laser

Surface damage characteristics of AlN ceramics induced by ultra-precision grinding

Creating extreme subsurface integrity by laser-induced material self-organization

Effects of laser beam lead angle on picosecond laser processing of silicon nitride ceramics

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

Experimental and MD simulation study of surface residual stress and surface quality of SiCp/Al in pulsed laser-ultrasonic assisted grinding

Effect of grinding parameters on surface quality in internal grinding of silicon nitride ceramics

Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics