Abstract:The ability to pattern planar and freestanding 3D metallic architectures would enable numerous applications, including flexible electronics, displays, sensors, and antennas. Low melting point metals, such as gallium, have recently drawn considerable attention especially in the fields of flexible and stretchable electronics and devices owing to its unique properties, such as excellent electrical conductivity and fluidity. However, the large surface tension, low viscosity, and large density pose great challenges to 3D printing of freestanding gallium structures in a large scale, which hinder its further applications. In this article, we first propose an electrochemically enabled embedded 3D printing (3e-3DP) method for creating planar and freestanding gallium wire-like structures assisted with supporting hydrogel. After an enhanced solidification process and the removal of hydrogel, various freestanding 2D and 3D wire-like structures are realized. By simply reassembling the gallium structure into soft elastomer, a gallium-based flexible conductor and a 3D-spiral pressure sensor are demonstrated. Above all, this study presents a brand-new and economical way for the fabrication of 2D and 3D freestanding gallium structures, which has great prospects in wide applications in flexible and stretchable electronics and devices.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c16438?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c16438</a>.(Figure S1) O 1s X-ray photoelectron spectroscopy (XPS) of printed liquid gallium with (red) or without (blue) a black layer; (Figure S2) SEM of printed and solidified liquid metal with an oxide layer (a) and blackened oxide layer (b) at 100 and 1000 magnifications, respectively; (Figure S3) X-ray photoelectron spectroscopy (XPS) of printed liquid gallium with (a) or without (b) a black layer; (Figure S4) the relationship between wire diameter and printing depth; (Figure S5) the unsolidified graph of liquid gallium in the hydrogel at −20 °C for 6 h; (Figure S6) the resistance change of the prepared sensor under different pressures (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c16438/suppl_file/am0c16438_si_001.pdf">PDF</a>)(Movie S1) The printing process of liquid gallium in hydrogel (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c16438/suppl_file/am0c16438_si_002.mp4">MP4)</a>(Movie S2) The connectivity test of the sensor by using an LED bulb after cutting off and reconnecting <a class="ext-link" href="/doi/suppl/10.1021/acsami.0c16438/suppl_file/am0c16438_si_003.mp4">MP4</a>)This article has not yet been cited by other publications.

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