Abstract:Liquid‐metal alloys are now extensively used for stretchable electronic applications due to their superior electrical conductivity, non‐toxicity, and mechanical stability in micro‐channels. Needle‐injection and direct‐writing are the most popular techniques for patterning micro‐structured liquid metal alloys. However, embedded channels often require a very high pressure to inject liquid‐metal, and direct writing by dispensing is relatively complex due to the low viscosities and high surface tension of the metal which cause liquid to normally dispense in droplets rather than a stream. In this work, a technique to co‐axially extrude liquid‐metal alloy within an encapsulating cover fluid has been presented to obtain a continuous stable stream of liquid‐metal. Fused deposition modeling (FDM) 3D printing has been adapted to co‐extrude a liquid‐metal core with a shell made from a thermoplastic elastomer. A custom extruder system is used to directly produce conductive micro‐wires (diameter: ≈25 μm) of liquid‐metal having an insulating shell of styrene‐ethylene‐butylene‐styrene which can be stretched up to four times the original length without any noticeable mechanical and electrical loss. The system is capable of printing in‐plane conductive pathways as well as out‐of‐plane functional devices with direct‐stable encapsulation of liquid‐metal wires. This technology has been successfully used to print 2D‐pressure and 3D‐strain sensors. A multi‐material extruder system is developed to coaxially extrude a liquid metal core with a thermoplastic elastomer shell. This technology allows direct printing of liquid metal‐based 2D pressure and 3D strain sensors. The technique is capable of producing micro‐wires with liquid metal cores of 25 μm diameter when combined with drawing steps. These micro‐wires are extremely flexible and stretchable up to 300% without substantial mechanical or electrical changes.

Flexible and Stretchable Liquid‐Metal Microfluidic Electronics Using Directly Printed 3D Microchannel Networks

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Direct 3D Printing of Stretchable Circuits via Liquid Metal Co‐Extrusion Within Thermoplastic Filaments

Self-sintering liquid metal ink with LAPONITE? for flexible electronics

Printable Liquid Metal Microparticle Ink for Ultrastretchable Electronics

3D‐Printed Multi‐scale Fluidics for Liquid Metals

Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL)

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Omnidirectional Printing of Soft Elastomer for Liquid-State Stretchable Electronics.

Multimaterial Printing of Liquid Crystal Elastomers with Integrated Stretchable Electronics

All‐Printed Flexible and Stretchable Electronics with Pressing or Freezing Activatable Liquid‐Metal–Silicone Inks

Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits

3D Printing for Functional Electronics by Injection and Package of Liquid Metals into Channels of Mechanical Structures

Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits

Hybrid Printed Rigidity‐Programmable Substrate/Liquid Metal 3D Circuits Toward Stretchable Electronics

High-resolution, reconfigurable printing of liquid metals with three-dimensional structures

Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics

Revolutionizing flexible Electronics: Integrating liquid metal DIW 3D printing by bimolecular interpenetrating network

Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits