Improved out-of-plane thermal conductivity of boron nitride nanosheets filled polyamide 6/polyethylene terephthalate composites by rapid solidification method

Qingchong Xu,Zhenxing Chen,Xinxin Li,Jiaxin Hu,Yanling Liao,Yongfeng Liu,Long Li,Shiyang Wei,Ziwei Li
DOI: https://doi.org/10.1039/d2ma00985d
2023-01-14
Materials Advances
Abstract:High thermal conductivity insulating polymer composite is important for the heat dissipation problem in electronic equipment. The modified boron nitride nanosheets (m-BNNS), prepared by ultrasonic exfoliation and ternary blend organic silanol modification, were used to improve the out-of-plane thermal conductivity of the polyamide 6/polyethylene terephthalate (PA6/PET) matrix through a rapid solidification method including solution mixing, rapid solidification, and hot pressing. Compared with directly hot-pressed composites, the m-BNNS in rapidly solidified m-BNNS/PA6/PET composites existed in a randomly orientated state, which is more conducive to constructing a heat transfer network in the parallel heat flux direction. The randomly orientated m-BNNS could make the thermal conductivity of PA6/PET composite film as high as 3.28 W/(m·K) at filler loading 55 wt%, which is 64% higher than that of directly hot-pressed h-BN/PA6/PET composite film. Non-equilibrium molecular dynamics simulations (NEMD) show that both the increase in numbers of boron nitride nanosheets (BNNS) layers and the orientation change from vertical heat flow to parallel heat flow can effectively improve the phonon density of states overlap area BNNS and PA6/PET, thereby enhancing interfacial thermal conductance (Gk).
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