High strain rate mechanical behavior of Ti-6Al-4V with micro–macro correlation under compressive loading
Liqiang Chen,Lei Pan,Haijun Xuan,Zhigang Sun,Xuming Niu,Yingdong Song,Yao Zheng
DOI: https://doi.org/10.1016/j.engfailanal.2023.107913
IF: 4
2024-01-04
Engineering Failure Analysis
Abstract:The application of Ti6Al 4V in lightweight structures subjected to impact loads necessitates a comprehensive understanding of its dynamic response under high strain rates to ensure the safety and reliability of these components. In this paper, the macroscopic compressive mechanical behavior of Ti 6Al 4V under high strain rates was investigated through the split-Hopkinson pressure bar (SHPB) technique at both room temperature and 200 °C, followed by microstructure analysis of the compressed specimens, carried out employing a combination of optical microscopy (OM) and electron backscatter diffraction (EBSD), and elastic modulus and hardness measurements, performed by a nanoindentation instrument. At room temperature, both the modulus and strain hardening exponent of Ti 6Al4V exhibited an initial increase before the strain rate reached 1000 s -1 , after which they decreased at 3400 s -1 . Meanwhile, the flow stress continued to rise with increasing strain rate. Microscopic observations revealed that twinning played a substantial role in the strain hardening effects. Notably, the basal slip system of the hcp (hexagonal close packed) α phase did not display a more favorable trend, while the c+a type slip systems became more active. Under a strain rate of 5000 s -1 , discontinuous dynamic recrystallization emerged as the dominant mechanism, resulting in an increased frequency of low-angle grain boundaries, as well as a reduction in grain size and dislocation density. These results provide a basis for explaining the mechanical behavior of Ti 6Al 4V under high strain rates and offer insights for the establishment of material models that take into account microstructure deformation mechanisms.
engineering, mechanical,materials science, characterization & testing