Alumina and Silicone Oxide Dielectric Films for Focal Plane Arrays Based on InSb

Mirofyanchenko, A. E.
DOI: https://doi.org/10.1134/S1064226922090108
2022-09-22
Journal of Communications Technology and Electronics
Abstract:In this study, MIS structures In/Al 2 O 3 /InSb and In/SiO x /anodic oxide/InSb were characterized. The A2O3 insulator layer were formed by the atomic layer deposition method. For second sample, we applied combination of insulators, which include anodic oxide film and SiO x layer deposited by the resistive evaporation method. For both structures, we mapped a fixed charge and interface trap level over 2-inch InSb wafers. The average value of the fixed charge level, NF, for MIS-structures In/Al 2 O 3 /InSb and In/SiO x /anodic oxide/InSb were 1.4 × 10 11 cm –2 and 2.9 × 10 11 cm 2 , respectively. The spread of Dit values over the wafer in the In/Al 2 O 3 /InSb MIS structure did not exceed 9% that confirms feasibility Al 2 O 3 insulators films deposited by ALD as a passivation coating for InSb-based photodiode arrays..
telecommunications,engineering, electrical & electronic
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