Experimental study of thermal annealing effects on evaporated platinum thin film with various substrate configurations

Ashish Kr. Chauhan,Suvashish Tiwari,Satyapal Singh,Jaspreet Singh,Manoj Wadhwa
DOI: https://doi.org/10.1007/s00542-022-05394-6
2022-11-05
Microsystem Technologies
Abstract:In this manuscript, thermal annealing effects on platinum (Pt) thin film on various substrate configurations have been studied experimentally. The objective of this study is to attain a thermally stable 'Pt' film that can sustain annealing temperatures > 500 °C for gas sensing applications. 200 nm thick 'Pt' was evaporated using Electron Beam (E-Beam) Evaporation System on silicon substrate. High temperature (> 450 °C) degradation of platinum films with different adhesion layers of titanium and its oxide was examined on silicon substrate. Impact of annealing at two different peak temperatures viz. 450 °C and 520 °C on platinum film was studied in terms of 'Pt' film morphological changes and electrical resistance variations. A novel method of making platinum micro-heater on titanium oxide film (prepared using rapid thermal anneal process) is described, which results into stable platinum film at annealing temperatures up to 520 °C.
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