An improved framework based on four-parameter viscoelastic model for stress analysis of adhesively-bonded single stepped-lap joints

Mehdi Veisytabar,Arash Reza,Younes Shekari
DOI: https://doi.org/10.1080/15376494.2022.2114037
2022-08-25
Mechanics of Advanced Materials and Structures
Abstract:The present study introduces an improved framework to analyze the longitudinal, shear, and peel stresses in the single stepped-lap joints under tensile loading based on a four-parameter viscoelastic model. To model the viscoelastic behavior of adhesive, the standard linear solid model is used. The governing differential equations are derived in the Laplace domain and are simultaneously solved and transformed using the Gaver–Stehfest inverse Laplace method. It was found that a rise in the butt thickness reduces the shear stress and increases the peel stresses. Moreover, an increase in the adhesive thickness reduces the longitudinal stress.
materials science, multidisciplinary,mechanics, composites, characterization & testing
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