MAPS sensor for radiation imaging designed in 180 nm SOI CMOS technology

M. Havranek,T. Benka,M. Hejtmanek,Z. Janoska,V. Kafka,J. Kopecek,M. Kuklova,M. Marcisovska,M. Marcisovsky,G. Neue,P. Svihra,L. Tomasek,P. Vancura,V. Vrba
DOI: https://doi.org/10.1088/1748-0221/13/06/C06004
2019-10-03
Journal of Instrumentation
Abstract:In this work, we present a prototype of the Monolithic Active Pixel Sensor (MAPS) called X-CHIP-02 designed in 180 nm SOI CMOS technology. The selected technology has attractive features for fabrication of X-ray imaging sensors: 100 Ω⋅ cm handle wafer resistivity, thick epitaxial layer to suppress back-gate effect, support of high voltage devices and deep trench isolation. X-CHIP-02 has two pixel matrices with the pixel pitch of 50 μm and 100 μm with integrated 8-bit photon counting circuitry. Fine pitch SOI monolithic pixels imply small capacitance and thus small electronic noise of ≈50 e − . Design of the sensor chip and basic radiation imaging capabilities are described in this paper.
instruments & instrumentation
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