Improved Drain Current Characteristics of HfO2/SiO2 Dual Material Dual Gate Extension on Drain Side-TFET

B. Balaji,K. Srinivasa Rao,K. Girija Sravani,Kalivaraprasad B,N. V. Bindu Madhav,K. Chandrahas,B. Jaswanth
DOI: https://doi.org/10.1007/s12633-022-01955-6
IF: 3.4
2022-06-17
Silicon
Abstract:We Proposed Dual Material Dual Gate Extension on Drain side TFET (DMDGED-TFET) and have analyzed, confirmed Performance characteristics in 10 nm technology. The TFET is a transistor and has a tunneling mechanism that can acts as a switch on and off at lower voltages compared to the MOSFET, and its excellent for low-power applications. The motivation for this new innovations are dual gate dual material is extended on drain side with high and low dielectric constants being HfO 2 and SiO 2 .The output characteristics of DMDGED-TFETs with three distinct materials, Hafnium Oxide (HfO 2 ), Silicon Nitride (Si 3 N 4 ), and Silicon Carbide(6H-SiC), are used to design the proposed device, and HfO 2 is formed on Silicon(Si) Substrate. The proposed structure was designed using Silvaco TCAD and attained improved output characteristics with HfO 2 / SiO 2 material with a Gate Length of 10 nm to obtain a good potential on current (Ion).
materials science, multidisciplinary,chemistry, physical
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