Effect of drying temperature on the curing properties of phenolic resin-impregnated heat-treated bamboo bundles
Shasha Song,Jianzheng Qiao,Xiaofeng Hao,Ting Li,Xingong Li,Kang Xu,Xianjun Li,Yiqiang Wu
DOI: https://doi.org/10.1080/17480272.2024.2344019
2024-04-29
Wood Material Science and Engineering
Abstract:Unreasonable drying temperatures may lead to precuring of phenolic (PF) resin-impregnated heat-treated bamboo bundles before hot-pressing, which is detrimental to the bonding performance of the bamboo scrimber during hot-pressing. In this study, PF resin-impregnated heat-treated bamboo bundles were dried at 50°C, 60°C, and 70°C for 16 h (PHB 50 , PHB 60 , and PHB 70 ) and then prepared into bamboo scrimber (BS 50 , BS 60 , and BS 70 ) by hot-pressing. The relationship between the curing properties of the PHB wet after drying and the water uptake of BS specimens was analyzed, which showed that the water uptake of BS was inversely proportional to the drying temperature. The curing degrees of the PHB 50 , PHB 60 , and PHB 70 were 27%, 58%, and 60%, respectively. The water uptake of BS 50 , BS 60 , and BS 70 after 24 h immersion in room-temperature water was 5%, 11%, and 19%, respectively, resulting in thickness swelling rates of 1%, 2%, and 4%. Compared with BS 50 , the cross-section of BS 70 broke more easily during the cyclic treatment and showed more cracks afterward. The relative contents of C–O bonds and hydroxymethyl groups decreased, indicating that the PHB specimens underwent pre-curing at higher drying temperatures, which inhibited interfacial bonding during hot-pressing.
materials science, paper & wood