Abstract:Subsurface damage (SSD) produced in a grinding process will affect the performance and operational duration of single-crystal silicon. In order to reduce the subsurface damage depth generated during the grinding process by adjusting the process parameters (added), experiments were designed to investigate the influence of machining factors on SSD. This included crystal orientation, diamond grit size in the grinding wheel, peripheral speed of the grinding wheel, and feeding with the intention to optimize the parameters affecting SSD. Compared with isotropic materials such as glass, we considered the impact of grinding along different crystal directions and on subsurface damage depth (added). The Magnetorheological Finishing (MRF) spot technique was used to detect the depth of SSD. The results showed that the depth of SSD in silicon increased with the size of diamond grit. SSD can be reduced by either increasing the peripheral speed of the grinding wheel or decreasing the feeding rate of the grinding wheel in the crystal orientation, if the same size of diamond grit was employed. In addition, we proposed a modified model around surface roughness and subsurface crack depth, which considered plastic and brittle deformation mechanisms and material properties of different crystal orientations. When the surface roughness (R-Z) exceeded the brittle-plastic transition's critical value R-ZC (R-ZC > 1.5 mu m, R-ZC > 0.8 mu m), cracks appeared on the subsurface. The experimental results were consistent with the predicted model, which could be used to predict the subsurface cracks by measuring the surface roughness. However, the model only gives the approximate range of subsurface defects, such as dislocations. The morphology and precise depth of plastic deformation subsurface defects, such as dislocations generated in the fine grinding stage, needed to be inspected by transmission electron microscopy (TEM), which were further studied.

Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon

Modeling of the Removal Mechanism of Monocrystalline Silicon-Based on Phase Change-Dislocation Theory and Its Edge Chipping Damage During Micro-Grinding

Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon

Nano-grinding Process of Single-Crystal Silicon Using Molecular Dynamics Simulation: Nano-grinding Parameters Effect

Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon

Theoretical Study on the Monocrystal Silicon Nanometric Grinding Process

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

Study on Preparation and Processing Properties of Mechano-Chemical Micro-Grinding Tools

Theoretical and Experimental Analysis on Super Precision Grinding of Monocrystal Silicon

Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding

Superimpose mechanism of surface generation process in grinding of monocrystalline silicon using molecular dynamics simulation

Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers

The Influence of Crystal Orientation on Subsurface Damage of Mono-Crystalline Silicon by Bound-Abrasive Grinding

Generation and distribution of residual stress during nano-grinding of monocrystalline silicon

Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding

Insights into Interfacial Mechanism of CeO2/Silicon and Atomic-Scale Removal Process During Chemo-Mechanical Grinding of Silicon.

Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics

Characteristics of Silicon Substrates Fabricated Using Nanogrinding and Chemo-Mechanical-grinding

Sensitivity Analysis of the Surface Integrity of Monocrystalline Silicon to Grinding Speed with Same Grain Depth-of-cut

Study of 40Cr surface modification grinding force and temperature based on microstructure evolution mechanism

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon