Thermal and dielectric properties of epoxy/DDS/CTBN adhesive modified by cardanol-based benzoxazine

Chengxi Zhang,Xiaoxia Luo,Rongqi Zhu,Hong Ling,Yi Gu
DOI: https://doi.org/10.1080/01694243.2015.1004508
IF: 2.431
2015-02-03
Journal of Adhesion Science and Technology
Abstract:Cardanol-based benzoxazine (Bz-C) was introduced to a ternary resin system to substitute carboxyl-terminated butadiene–acrylonitrile (CTBN) partially and improve the thermal and dielectric properties of the diglycidyl ether of bisphenol-A (epoxy)/4,4′-diaminodiphenylsulfone (DDS)/CTBN adhesive resin system. The effect of Bz-C on the curing behavior of blends was studied, and factors that affect the thermal, mechanical, and dielectric properties were discussed systematically. Results show that reactions between Ep, DDS, and Bz-C decrease the curing temperature of the quaternary blends and increase the cross-linking densities of the network, leading to higher glass-transition temperature and enhanced mechanical properties. The flexibility of the copolymer films was maintained by the introduction of the aliphatic side chain of Bz-C. Substitution of Bz-C for some group of CTBN in the cross-linked network resulted in decreased dielectric constant and dielectric loss in the copolymer films.
materials science, multidisciplinary,engineering, chemical,mechanics
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